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ConnectCore™ 9P 9360

  • Module processeur à noyau ARM9 compact
  • Processeur NS9360/NS9750
  • Support plate-forme logicielle embarquée pour NET+OS®, Windows® CE et Linux

Les modules ConnectCore 9P combinent les performances évolutives des processeurs NetSilicon NET+ARM 32 bits et un ensemble complet de périphériques intégrés sous un format polyvalent.

La variété des environnements de développement, fait du module ConnectCore 9P le choix idéal quand votre application exige performance et connectivité étendue; format compact, rapidité du temps de réponse, connexion réseau sécurisée (offerts par notre environnement NET+OS® ThreadX®); ensemble complet et évolutif de composants logiciels et d’applications de Microsoft Windows CE; ouverture, flexibilité et puissance de l'environnement Linux et de sa bibliothèque logicielle étendue.

 

Linux Development Kits Amérique du Nord: International:  
ConnectCore 9P 9750 LxNETES 3.1 Development Kit
Plus d'info 
FS-9032
FS-9032

Nous contacter
Microsoft Windows CE Development Kits Amérique du Nord: International:  
ConnectCore 9P 9750 Microsoft Windows CE 5.0 Development Kit with 5.7" LCD (TFT) and Touch Screen
Plus d'info 
FS-9091
FS-9091

Nous contacter
Platform ConnectCore™ 9P 9360
Hardware
Processor Type 32-bit Digi NS9360 high-performance RISC processor
ARM Core ARM926EJ-S
Processor Speed 177 MHz
Cache 4k D-Cache/8k I-Cache
Memory Population Up to 128 MB NAND flash
Up to 128 MB SDRAM
Serial EEPROM 8 KB
UART 4 high-speed UARTs
Maximum data rate 921.6 Kbps
GPIO Up to 55 shared GPIO ports
with 7 high-current (8 mA) pin options
SPI Up to 4 SPI ports
Master data rate up to 11.25 Mbps
Slave data rate up to 5.5 Mbps
I2C Fast mode (400 kHz) and normal mode (100 kHz) support
7-bit and 10-bit address modes
USB USB 2.0 Host/Device low/full speed interface
with internal PHY (external PHY interface available)
 
Parallel operation of host and device using
combination of internal PHY and external PHY
External Memory Bus 28-bit address/32-bit data
LCD Controller Up to SVGA (800x600) resolution
 
Up to 18 bpp; 256K colors (TFT)
1, 2, 4 bpp palletized grayscale (STN)
Up to 16 bpp 4:4:4 RGB, 3375 colors (Color Passive Matrix)
Timers/PWM Up to 8 independent 16-/32-bit programmable timers/counters
Up to 4 PWM functions
External IRQs 4
Real-Time Clock
(no battery-backup)
JTAG
Pins/Form Factor Small-footprint module with 2 x 120-pin board-to-board connectors
Dimensions (L x W x H) 2.362 in (60 mm) x 1.732 in (44 mm) x 0.0395 in (10.0 mm)
Network Interface - Wired
Standard IEEE 802.3
Physical Layer 10/100Base-T
Data Rate 10/100 Mbps (auto-sensing)
Mode Full or half duplex (auto-sensing)
Environmental
Operating Temperature 0° C to 70° C (32° F to 158° F)
Industrial temperature version available. See website for information.
Storage Temperature -50° C to 125° C (-58° F to 257° F)
Relative Humidity 5% to 90% (non-condensing)
Altitude 12,000 feet (3,658 meters)
Power Requirements (3.3V)
Maximum 400 mA
Regulatory Approvals
FCC Part 15 Class B
EN55022:2006 Class B
ICES-003, Class B
VCCI, Class B
EN55024:1998 +A1:2001, A2:2003
EN61000-3-2:2006
EN61000-3-3:1995 +A1:2001, A2:2005
UL 60950-1, EN 60950 (EU)

• Module Feature

Bottom View

Top View

Side View

 

 

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