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Digi Connect® EM


Hardware

  • 32-bit NET+ARM high-performance RISC processor (NS7520 @ 55 MHz)
  • On-board memory 4 MB Flash and 8 MB RAM
  • On-board power supervisor
  • 2 high-speed TTL serial interfaces
    • Throughput up to 230 Kbps
    • Full signal support for TXD, RXD, RTS, CTS, DTR, DSR and DCD on port 1
    • TXD / RXD signals on port 2
    • Hardware/software flow control
  • Serial Peripheral Interface (SPI)
  • 9 shared General Purpose Input/Output (GPIO) ports
  • Wave-solderable design (no clean flux process)

Regulatory Previews

  • FCC, Part 15 Class B
  • EN55022, Class B
  • EN61000-3-2 and EN61000-3-3
  • ICES-003, Class B
  • VCCI, Class II
  • AS 3548
  • FCC Part 15 Subpart C Section 15.247
  • IC (Industry Canada) RSS-210 Issue 5 Section 6.2.2(o)
  • EN300 328
  • EN301 489-3
  • UL 60950-1
  • EN60950 (European Union)
  • CSA C22.2, No. 60950
  • EN55024

Network Interface

  • Standard: IEEE 802.3
  • Physical Layer: 10/100Base-T
  • Data rate: 10/100 Mbps (auto-sensing)
  • Mode: Full or half duplex (auto-sensing)
  • Connector: RJ-45 or pin header

Environmental

  • Operating temperature: -40º C to +85º C (-40º F to +185º F)
  • Relative humidity: 5% to 90% (non-condensing)
  • Altitude: 12,000 ft (3657.6 m)

LEDs

  • Link integrity
  • Diagnostic
  • Serial activity
  • Network activity

Power Requirements

  • 3.3VDC @ 270 mA max (891 mW)

Dimensions

  • Digi Connect EM
    • Length: 1.935 in (49.149 mm)
    • Width: 1.575 in (40.005 mm)
    • Height: 0.803 in (15.621 mm) (Fully Populated Model)
    • Height: 0.670 in (17.018 mm) (Pin Header Model)

Wireless Security

  • WEP (Wired Equivalent Privacy)
    • 64/128-bit encryption (RC4)
  • WPA (Wireless Protected Access)/WPA2/802.11
    • 128-bit TKIP/CCMP encryption
    • 802.1x EAP authentication
      • LEAP, PEAP, TTLS, TLS
      • GTC, MD5, OTP, PAP, CHAP, MSCHAP,
        MSCHAPv2,TTLS MSCHAPv2
    • Pre-shared key mode (PSK)

Line Art

  • Digi Connect EM - Front
  • Digi Connect EM - Bottom
 

 

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