New XBee® and XBee-PRO® modules feature Surface Mount Technology and Serial Peripheral Interface
MINNETONKA, Minn. (June 8, 2010) - Digi International (NASDAQ: DGII) today introduced a new line of XBee and XBee-PRO ZB embedded ZigBee modules based on the Ember EM357 System on Chip (SoC). The new modules add Surface Mount Technology (SMT) and Serial Peripheral Interface (SPI) to the product family. The SMT modules are ideal for high-volume applications in the energy and controls markets where manufacturing efficiencies are critical. The addition of Serial Peripheral Interface (SPI) provides high-speed throughput and optimizes integration with embedded micro controllers lowering costs of development and shortening time to market.
“The enhanced technology will be the standard for all future XBee releases,” said Larry Kraft, senior vice president of global sales and marketing, Digi International. “Integrated into a vast number of devices throughout the world, the XBee product line improvements make the modules an even better choice for Smart Energy and other ZigBee networking applications. We’re also introducing a more aggressive pricing structure as a result of improved product design and lower manufacturing costs.”
“Ember is the industry’s leading provider of ZigBee networking systems including chips, stack and tools and Digi is a strong partner developing wireless networking solutions,” said Dennis Natale, Ember vice president of sales. “Built on our EM357 ZigBee SoC and EmberZNet PRO stack, Digi’s XBees make it easier, faster and more cost effective to develop many ZigBee Smart Energy solutions and other ZigBee enabled devices.”
XBee and XBee-PRO ZB ZigBee modules feature ZigBee Smart Energy-ready firmware for supporting the implementation of each of the eight devices defined in the ZigBee Smart Energy public application profile. Products developed with the ZigBee Smart Energy profile will be ideal for metering devices, load controllers, in-home displays and other ZigBee Smart Energy devices.
The new modules with SMT will be backwards compatible with existing hardware and software allowing customers to leverage their existing XBee deployments. Available in a variety of protocols for different applications, one XBee can be substituted for another with minimal development time or risk. When coupled with a ConnectPort X gateway, customers canalso use the iDigi™ Platform to easily integrate XBee ZigBee endpoints into their systems.
Next-generation XBee ZB modules will be available in July for $17 in single module pricing. Next-generation extended-range XBee-PRO ZB modules will be available in August for $28 in single module pricing. New versions of all XBee modules including the programmable XBee-PRO ZB will be released throughout the year. For more information, visit www.digi.com/products/wireless/zigbee-mesh/xbee-smt.jsp#overview. For more information about iDigi, visit www.idigi.com.
About Digi International
Digi International is making wireless M2M easy by developing reliable products and solutions to connect and securely manage local or remote electronic devices over the network or via the Web. Digi offers the highest levels of performance, flexibility and quality, and markets its products through a global network of distributors and resellers, systems integrators and original equipment manufacturers (OEMs). For more information, visit Digi's Web site at www.digi.com, or call 877-912-3444.
Ember Corporation develops wireless mesh networking technology – chips, software, tools – for Smart Energy, connected homes, as well as many other monitoring and control applications enabling greener living and work environments. The Boston-based company is a promoter of the ZigBee Alliance with an IC design center in Cambridge, England, office in Hong Kong and sales channels worldwide.