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Digi Launches Industry's First System-on-Module with Global 3G Cellular Connectivity

Featuring Qualcomm Gobi™ technology, new ConnectCore 3G™ allows OEMS to develop devices that can connect virtually anywhere in the world without changing hardware

MINNETONKA, Minn. (Nov. 9, 2010) - Digi International (NASDAQ: DGII) today introduced the ConnectCore 3G, the industry’s first embedded module with integrated application processing and Qualcomm Gobi technology. Gobi technology supports High Speed Packet Access (HSPA) or Evolution-Data Optimized (EV-DO) networks, the two dominant standards for 3G data networks, from the same cellular radio. Ideal for developing remote device management solutions in energy, fleet management, digital signage, industrial automation, security/access control and other markets, customers can now develop one solution for use anywhere in the world with the same hardware. Combined with iDigi™ cloud computing services, the ConnectCore 3G allows customers to easily build scalable, secure and cost effective cellular solutions with global network connectivity. 

“The ConnectCore 3G is perfect for device manufacturers that are tired of deciding between HSPA and EV-DO or doing two hardware developments to satisfy worldwide connectivity requirements,” said Larry Kraft, senior vice president of global sales and marketing, Digi International. “And as a System-on-Module with robust application processing capability, it is an ideal core platform for OEMs to rapidly develop globally connected devices.”

The ConnectCore 3G offers complete support for iDigi, the embedded industry’s first ready-to-use cloud computing platform for M2M network management. iDigi enables secure remote access, control and management of network-connected devices and complete cloud-based application development. Featuring an easy-to-use development environment, the ConnectCore3G can be programmed using iDigi Device Integration Application (iDigi Dia) or open-source Python. It also includes a familiar Eclipse-based integrated development environment that allows Web developers to rapidly develop embedded applications.

The ConnectCore 3G is a member of the ConnectCore 9P 9215 ARM9-based Ethernet networking module family. Featuring cellular, Wi-Fi and wired versions, ConnectCore 9P 9215 modules are pin-compatible and interchangeable. ConnectCore 9P 9215 modules include two Flexible Interface Modules (FIMs) that allow customers to load and use application-specific interfaces such as Secure Digital, Controller Area Network (CAN), 1-Wire, additional UARTs and others. This allows users to custom configure the module for specific application needs. The modules also offer advanced networking protocols like IPv6, SNMPv3 and SSL.

ConnectCore 3G Digi JumpStart development kits will be available in December 2010 for $499. For more information, visit www.digi.com/ConnectCore3G. For more information about iDigi, visit www.idigi.com.

About Digi International

Digi International is making wireless M2M easy by developing reliable products and solutions to connect and securely manage local or remote electronic devices over the network or via the Web. Digi offers the highest levels of performance, flexibility and quality, and markets its products through a global network of distributors and resellers, systems integrators and original equipment manufacturers (OEMs). For more information, visit Digi's Web site at www.digi.com, or call 877-912-3444.

Press Contacts:
Jan McBride
Digi International
952-912-3473

Matt Serra
Mulberry Marketing Communications
312-664-1532

For more information, visit Digi's Web site at www.digi.com, or call 877-912-3444 (U.S.) or 952-912-3444 (International).

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