The Digi M2M Solution Builder Kit delivers a complete, flexible and cloud-enabled solution out-of-the-box. Based on a powerful Intel Atom processor combined with a wide range of connectivity options, it is the product platform choice for a wide range of demanding M2M applications. Built as a Digi end-to-end solution, including hardware, software and services, this kit enables customers to design and deploy connected M2M solutions quickly and easily by developing on a Linux based product platform.
Wind River® Intelligent Device Platform, based on Wind River Linux, is a complete software development environment for jump-starting machine-to-machine (M2M) device development.
The kit includes a certified gateway with all available connectivity options, such as 2G/3G cellular, dual-band Wi-Fi, Gigabit Ethernet and 802.15.4. It offers tremendous flexibility with the ability to grow with customers and market requirements. Future connectivity extensions such as 4G/LTE cellular, Bluetooth 4.0 and ZigBee can be easily added.
Based on an Intel Atom processor, the gateway is ideal for processing-intensive and audio/video enabled applications covering a wide variety of markets. These include industrial automation, building automation, security/surveillance, digital signage, kiosk, healthcare and more.
Device Cloud by Etherios™ provides remote management and secure data integration services, enabling the development of smart connected devices with a scalable product deployment.
The kit provides the professional Wind River Linux development environment tailored for the specific needs of M2M applications and enabling rapid development of cloud-connected solutions.
Digi offers complete Device Cloud application development services as well as wireless and hardware design services through Spectrum Design Services, a Digi subsidiary. Working with Digi as a single vendor reduces time, effort, complexity and design risk.
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Digi M2M Solution Builder Kit
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DG-M2M-SB-KIT Coming soon |
DG-M2M-SB-KIT |
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| Development Kit | North America: | International: | |
| Digi M2M Solution Builder Kit View details |
DG-M2M-SB-KIT |
DG-M2M-SB-KIT |
Contact Us |
| Specifications | Digi M2M Solution Builder Kit |
| General | |
| Processor | Intel® Atom™ E620T @ 600 MHz |
| Chipset | Intel® Platform Controller Hub EG20T |
| Cache | 32 KB I-Cache, 24 KB L1 Cache, 512 KB L2 Cache |
| Memory | 1 GB DDR2 |
| External Supply | 100-240 VAC, 50/60 Hz input/rating, 12 VDC, 2A input/rating |
| User Interface | Reset button, user button, LED status indicators |
| Expansion | Up to 4 internal PCI Express Mini Card Connectors |
| Network Interface - Ethernet | |
| Standard | Gigabit Ethernet, IEEE 802.3-2008 |
| Connectivity - Cellular | |
| Technology/Bands | HSPA/UMTS (800/850/900/1900/2100 MHz), EDGE/GPRS/GSM (850/900/1800/1900 MHz), EV-DO/CDMA (800/1900 MHz) |
| Data Rates | HSDPA/HSUPA: 7.2 Mbps or 14.4 Mbps/5.76 Mbps, WCDMA: 384 kbps GSM: 14.14kbps, GPRS: 85.6 kbps/42.8 kbps, EDGE: 236.8 kbps/118.4 kbps EV-DO: 3.1 Mbps/1.8 Mbps, CDMA 1xRTT: 153 kbps, CDMA 1xEV-DO: 3.1/1.8 Mbps (DL/UL) |
| Power Class | HSPA/WCDMA: Class 3, GSM/GPRS 850/900 MHz: Class 4, GSM/GPRS 1800/1900 MHz: Class 1, EDGE: Class E2 |
| Dual Diversity | HSPA/UMTS/EV-DO/CDMA modes |
| Connectivity - Wi-Fi | |
| Bands | 2.4 / 5 GHz |
| MIMO | 2x2, up to 300 Mbps |
| Standards | 802.11a/b/g/n, 802.11d, 802.11e, 802.11i, 802.11h |
| Security | WPA/WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP,EAP-FAST), EAP-SIM, EAP-AKA, PAP, CHAP, TLS GTC, MS-CHAP, MS-CHAPv2 |
| Dual Diversity | • |
| Encryption | 64- and 128-bit WEP, AES-CCMP, TKIP |
| Peripherals | |
| USB 2.0 | 3 |
| Video | 2 |
| Audio | Headphone/Line Out, Microphone |
| Storage | 2 Micro SD (1 internal, 1 external) |
| Other | Three-axis linear accelerometer |
| Mechanical | |
| Dimensions (H x W x D) & Weight | 67 mm x 100 mm x 27 mm (92 mm x 100 mm x 62 mm w/mounting brackets), 0.36 kg unit (1.1 kg packaged kit) |
| Connectors | 2 x Cellular antenna, 2 x Wi-Fi / 802.15.4 antenna, Ethernet (RJ-45), 2 x MicroHDMI, Headphone/Line Out, Microphone, SIM card slot, MicroSD slot (external), MicroUSB 2.0 (Type B), USB 2.0 Type A, Power |
| Environmental | |
| Operating Temperature | -0° C to +50° C |
| Storage Temperature | -25° C to +70° C |
| Humidity | 5 to 95% RH @ 25-35° C non-condensing |
| Shock | Operating: 2G, 11 ms duration, 6 directions (half-sine); Non-operating: 25G, 11 ms duration, 6 directions (half-sine) |
| Approvals (Pending) | |
| Regulatory | FCC Class B, CE, Nemo NTRL 60950-1 |
| Cellular Carriers | AT&T, Sprint |
