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ConnectCore® 6

Freescale i.MX6 Cortex A9 system-on-module

  • Scalable Cortex-A9 multi-core performance
  • Cortex-M0+/M4 microcontroller assist
  • Cost-effective, reliable, low-profile surface-mount module form factor
  • Pre-certified 802.11a/b/g/n and Bluetooth 4.0 connectivity
  • Designed for reliability and long-term availability
  • Linux, Android and Windows Embedded software platform support
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Watch the ConnectCore 6 tour video

The ConnectCore 6 is an ultra-compact and highly integrated system-on-module (SOM) solution based on the Freescale i.MX6 Cortex-A9 processor family.

With processor speeds up to 1.2 GHz and fully interchangeable single-/dual-/quad-core variants, the ConnectCore 6 offers a truly future-proof platform solution with scalable performance and pre-certified wireless 802.11a/b/g/n and Bluetooth 4.0 connectivity, including Bluetooth Low Energy.

Its innovative and scalable design maximizes integration flexibility and significantly reduces design risk in a highly cost-effective, reliable, low-profile surface-mount form factor with optimal thermal management even in the most demanding quad-core system configurations.

Integrated cloud connectivity as part of the Digi Linux and Android software platform support offers secure remote management and web services capabilities through the scalable Device Cloud by Etherios™.

In addition, Digi offers complete professional Etherios custom hardware and wireless design services as well as end-to-end solutions services for cloud integration and app development.

Minimize risk with Digi Software Development Support
Our software support services significantly improve time-to-market by providing experienced software design engineers who can provide programming support, code consultation, and trouble shooting for many of the current development environments including but not limited to: Python, Java, Android, C/C++, and C#. Learn more.

Featured Models/Part Numbers

  North America: International:  
ConnectCore 6 Development Kit (Early Access)
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CC-WMX6-KIT
CC-WMX6-KIT

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Development Kits North America: International:  
ConnectCore 6 Development Kit (Early Access)
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CC-WMX6-KIT
CC-WMX6-KIT
BUY ONLINE
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Modules North America: International:  
ConnectCore 6 module, Solo i.MX6 1 GHz No Flash, 256MB RAM Extended Consumer, 1xEthernet
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CC-MX-J650-Z1
CC-MX-J650-Z1

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ConnectCore 6 module, Dual i.MX6 1.2 GHz 4GB Flash, 512MB RAM Extended Consumer, 1xEthernet
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CC-MX-J86C-Z1
CC-MX-J86C-Z1

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ConnectCore 6 module, Solo i.MX6 1 GHz No Flash, 256MB RAM Extended Consumer, 1xEthernet, 802.11abgn
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CC-WMX-J650-VE
CC-WMX-J650-VE

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ConnectCore 6 module, Dual i.MX6 1.2 GHz 4GB Flash, 512MB RAM Extended Consumer, 1xEthernet, 802.11abgn, Bluetooth 4.0
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CC-WMX-J86C-TE
CC-WMX-J86C-TE

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ConnectCore 6 module, Quad i.MX6 1.2 GHz 4GB Flash, 512MB RAM Extended Consumer, 1xEthernet, 802.11abgn, Bluetooth 4.0 Microcontroller Assist (Kinetis)
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CC-WMX-J97C-TN
CC-WMX-J97C-TN

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Specifications ConnectCore® 6
Application Processor Freescale i.MX 6Solo / DualLite / Dual / Quad
Cortex-A9 core, 1-4 cores, up to 1.2 GHz each
32 KB I-Cache / 32 KB D-Cache, up to 1 MB L2-Cache
Memory Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit)
PMIC Dialog DA9063
Graphics Multi-stream-capable HD video engine with 1080p60 decode,
1080p30 encode and 3D video playback in HD in high-performance families
Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support
Separate 2D and/or Vertex acceleration engines for UI support
Stereoscopic image sensor support for 3D imaging
Security RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
Peripherals/Interfaces MMC 4.4/SD 3.0 x3MMC 4.4/SDXC,
UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5,
ESAI, I2S/SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps),
USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2,
PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane),
HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2),
RTC, External address/data bus, Watchdog, Timers, JTAG
External Bus 26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes)
Ethernet 1 Gbit Ethernet + IEEE 1588
(MII10, MII100, RMII, RGMII)
Wi-Fi 802.11a/b/g/n:
2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm)
HT40, MCS 0-7
Security: WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i
Access Point Mode (up to 10 clients), Wi-Fi Direct
Industry Certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready
Bluetooth Bluetooth 4.0:
Class 1.5, Bluetooth 2.1 + EDR, Bluetooth 3.0 + HS 802.11 AMP, Bluetooth Low Energy
Profiles: GAP, SPP, HSP, HFP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP
On-Module Microcontroller Assist(tm) Kinetis KL2 (Cortex-M0+)
MKL26Z128VFT4/MKL26Z64VFT4/MKL2632VFT4
or
Kinetis K20 (Cortex-M4)
MK20DN32VFT5/MK20DX32VFT5/MK20DN64VFT5/MK20DX64VFT5/
MK20DN128VFT5/MK20DX128VFT5
Independent operation with interconnect to i.MX6 via SPI
Operating Temperatures (Tj) Industrial: -40° C to +105° C; Extended Commercial: -20° C to +105° C / Commercial: 0° C to +95° C
Storage Temperature Storage Temperature -50° C to +125° C (-58° F to +257° F)
Relative Humidity Relative Humidity 5% to 90% (non-condensing)
Altitude Altitude 12,000 feet (3,658 meters)
Radio Approvals* US, Canada, EU, Japan, Australia/New Zealand
Emissions / Immunity / Safety* FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3,
ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210
Issue 5 Section 6.2.2(o), EN 300 328,
EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
Design Verification* Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
Mechanical Dimensions 50 mm x 50 mm x 5 mm, fully shielded
LGA-400, 2 mm pitch
*Pending
 
 
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