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ConnectCore® i.MX53 / Wi-i.MX53

Freescale i.MX53 Cortex A8 system-on-module

Device Cloud by Etherios
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The network-enabled ConnectCore for i.MX53 is a highly integrated and future-proof system-on-module (SoM) solution based on the new Freescale i.MX53 application processor with a high performance 1 GHz ARM Cortex-A8 core, wired and wireless connectivity, powerful 1080p/720p video encoding/decoding capabilities, dual-CAN bus interface and a complete set of peripherals.

The ConnectCore for i.MX53 family builds on the successful ConnectCore for i.MX51 modules by providing a form factor compatible option with significantly improved processing, memory, video and connectivity capabilities. It is a scalable and energy-efficient module family that is ideal for medical devices, security/surveillance equipment, industrial applications, kiosk systems and digital signage integration.

Device

Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by Device Cloud by Etherios™. This secure, highly-scalable platform seamlessly ties enterprise applications and remote devices together.

Device Cloud empowers IT, network operations and customer support organizations to conquer the challenges of managing equipment in their device networks. Network managers can remotely configure, upgrade, monitor and troubleshoot remote devices, and create applications that improve productivity, speed and efficiency.

Minimize risk with Digi Software Development Support
Our software support services significantly improve time-to-market by providing experienced software design engineers who can provide programming support, code consultation, and trouble shooting for many of the current development environments including but not limited to: Python, Java, Android, C/C++, and C#. Learn more.

The ConnectCore for i.MX53 modules combine industry-leading performance, low power consumption and easy design integration with key features like integrated power management IC, on-chip multimedia support, including multi-format 1080p video hardware decoding, 2D/3D graphics acceleration, dual display/camera interface, hardware encryption engine, 802.11abgn Wi-Fi interface (150 Mbps), Bluetooth 4.0 with HDP support, dual 10/100 Ethernet option, dual-CAN bus, SATA II storage interface and a comprehensive set of additional peripherals.

Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by the Device Cloud. This robust cloud platform makes it easy to configure and manage deployments and integrate devices with virtually any application. Device manufacturers can build secure, highly scalable and cost-effective solutions that seamlessly tie assets to applications, regardless of location.

Complete and cost-efficient Digi JumpStart Kits® for Digi Embedded Linux, Android and Microsoft Windows Embedded Compact 7 allow immediate and professional embedded product development with dramatically reduced design risk and time-to-market. Additional support for Yocto Embedded Linux is also available for download.

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Featured Models/Part Numbers

  North America: International:  
ConnectCore for i.MX53 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen
View details
CC-WMX53-LX
CC-WMX53-LX
BUY ONLINE
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ConnectCore for i.MX53 JumpStart Kit for Microsoft Windows Embedded Compact 7, Download of 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen
View details
CC-WMX53-CE
CC-WMX53-CE
BUY ONLINE
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ConnectCore for i.MX53 JumpStart Kit for Android 2.3, installation and setup support package, 7" WVGA LCD panel w/touchscreen
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CC-WMX53-ANDRD
CC-WMX53-ANDRD
BUY ONLINE
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Development Kits North America: International:  
ConnectCore for i.MX53 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen
View details
CC-WMX53-LX
CC-WMX53-LX BUY ONLINE
Contact Us
ConnectCore for i.MX53 JumpStart Kit for Microsoft Windows Embedded Compact 7, Download of 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen
View details
CC-WMX53-CE
CC-WMX53-CE BUY ONLINE
Contact Us
ConnectCore for i.MX53 JumpStart Kit for Android 2.3, installation and setup support package, 7" WVGA LCD panel w/touchscreen
View details
CC-WMX53-ANDRD
CC-WMX53-ANDRD BUY ONLINE
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Modules North America: International:  
ConnectCore i.MX53 module, 800MHz, 1GB Flash, 512MB RAM, 1xEthernet, Industrial Temp, single pack
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CC-MX-LD6A-ZM
CC-MX-LD6A-ZM BUY ONLINE
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ConnectCore i.MX53 module, 800MHz, 1GB Flash, 512MB RAM, 1xEthernet, Industrial Temp, 25 pack
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CC-MX-LD6A-ZM-B
CC-MX-LD6A-ZM-B BUY ONLINE
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ConnectCore i.MX53 module, 800MHz, 512MB Flash, 1GB RAM, 2xEthernet, Industrial Temp, single pack
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CC-MX-LD79-ZK
CC-MX-LD79-ZK BUY ONLINE
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ConnectCore i.MX53 module, 800MHz, 512MB Flash, 1GB RAM, 2xEthernet, Industrial Temp, 25-piece bulk pack
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CC-MX-LD79-ZK-B
CC-MX-LD79-ZK-B BUY ONLINE
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ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 512 MB RAM, 2x Ethernet, 802.11abgn, single pack
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CC-WMX-KD69-VK
CC-WMX-KD69-VK BUY ONLINE
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ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 512 MB RAM, 2x Ethernet, 802.11abgn, 25-piece bulk pack
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CC-WMX-KD69-VK-B
CC-WMX-KD69-VK-B BUY ONLINE
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ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 512 MB RAM, 1x Ethernet, 802.11abgn, single pack
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CC-WMX-KD69-VM
CC-WMX-KD69-VM BUY ONLINE
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ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 512 MB RAM, 1xEthernet, 802.11abgn, 25-piece bulk pack
View details
CC-WMX-KD69-VM-B
CC-WMX-KD69-VM-B BUY ONLINE
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ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 1 GB RAM, 2x Ethernet, 802.11abgn, single pack
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CC-WMX-KD79-VK
CC-WMX-KD79-VK BUY ONLINE
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ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 1 GB RAM, 2x Ethernet, 802.11abgn, 25-piece bulk pack
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CC-WMX-KD79-VK-B
CC-WMX-KD79-VK-B BUY ONLINE
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Specifications ConnectCore i.MX53 ConnectCore Wi-i.MX53
Processor
Processor Model Freescale® i.MX535/i.MX537
Speed Grades 1000/800 MHz
Core Type ARM® Cortex™-A8
Cache Memory 32k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified)
Internal RAM 128 KB (secure/non-secure)
Vector Floating Point
NEON Media Acceleration
Memory
Flash Up to 8 GB NAND flash
RAM Up to 2 GB DDR2
Debug
Secure JTAG
ETM/ETB
Power Management
Power Modes Run, Wait, Stop, Low-power screen refresh
Wake-up Events GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach
Dynamic Voltage and Frequency Scaling
Backlight Drivers 3
Battery Management
Real Time Clock
Battery Backup (External)
Security
Hardware encryption/decryption AES, DES/3DES, RC4, C2
RSA, ECC
MD5, SHA-1/224/256
Random Number Generator
Run Time Integrity Checker
Secure RAM (internal)
Fuse Box (e-Fuses) 64 Bits (application-specific use)
Physical Tamper Detectors
Timers
General Purpose Timer 32-bit up-counter with clock source selection
2 input capture channels
3 output compare channels, forced compare
Enhanced Periodic Interrupt Timer 32-bit down-counter with clock source selection
Set-and-forget/free-running modes
Precision interrupt generation
Watchdog
Thermal Management
Temperature Monitor On-chip sensor, precision 0 to 135°C ±5°C
Software support for thermal-aware Dyamic Frequency and Voltage Scaling (DFVS)
Connectivity
UART Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support
IrDA Infrared Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps)
CAN Up to 2 channels, up to 1 Mbps each, CAN 2.0b (available on i.MX537 variant)
CSPI Master and slave mode
Bit rate up to 25 Mbps (master)
eCSPI Up to 2 eCSPI channels, master and slave mode, bit rates up to 52 Mbps
I2C Up to 2 eCSPI channels, master and slave mode
Bit rates up to 66.5 Mbps (master)
SD/SDIO/MMC/eMMC Up to 4 ports, 1-/4-/8-bit modes
MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode)
eMMC 4.4: Ultra high speed, up to 832 Mbps
I2C Up to 3 channels, master/slave (7-/10-bit addressing)
All: Standard (100 kbps) and fast (400 kbps) mode
P-ATA Up to 66 MB/s data rate
PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5)
SATA SATA II, up to 1.5 Gbps
USB 2.0 High-Speed Up to 3 USB 2.0 High-Speed Host ports (one with integrated PHY)
Up to 1 USB 2.0 OTG port with integrated PHY
Media Local Bus (MLB)

MOST (Media Oriented Systems Transport) interface, up to 50 Mbps

1-Wire
ISO 7816 (SIM/Smart Card)
Keypad 8x8 keypad matrix
PWM 2
ADC (10-bit) Up to 4 channels
GPIO Up to 128 GPIOs
External Memory Bus 16-bit data/28-bit address in non-multiplexed address/data mode
16-bit or 32-bit data/28-bit address in multiplexed address/data mode
Multimedia
Camera

Two parallel camera ports, up to 20-bit, up to 120 MHz peak

Display

Five interfaces available. Total rate of all interfaces is up to 180 Mpixels/sec, 24 bpp. Up to two displays can be simultaneously driven directly (screen refresh). Concurrent asyncronous access to two additional devices, e.g. display controllers and smart displays, is supported.

Two Parallel 24-bit display ports – up to 165 Mpixels/sec, e.g. UXGA @ 60Hz

LVDS serial ports: One port up to 165 Mpixels/sec or two ports up to 85 MP/sec each, e.g. WXGA @ 60Hz

One TV-out/VGA port up to 150 Mpixels/sec, e.g. 1080p60

Image Processing Unit Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction
Video Processing Unit MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG

1080p30 decode, 720p30 encode
GPU (2D/3D) 33 million triangles/sec, 200 million pixels/sec raw

OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0
Touchscreen Interface (4-wire)
SPDIF (Tx)
I2S/AC97/SSI Up to 3 channels
ESAI

Multi-channel digitial audio, up to 1.4 Mbps each channel

ASRC
Ethernet
Physical Layer 10/100Base-T
Data Rates 10/100 Mbps, auto-sensing
Duplex Mode Full or half duplex, auto-sensing
IEEE 1588 Yes, primary interface only (available on i.MX537 variant)
Power over Ethernet (802.3af)
Power Over Ethernet Development board ready for 802.3af PoE application kit (sold separately)
Accelerometer
Three-Axis Accelerometer ±2g/±4g/±8g Three-Axis Low-g
(Freescale MMA7455L)
Wireless LAN
Standard N/A 802.11a/b/g/n (2.4/5 GHz)
Antenna Connectors N/A 2 x U.FL
Dual Diversity (Receive) N/A
Frequency Bands N/A 2.412 - 2.484 GHz
4.900 - 5.850 GHz
Data Rates N/A 802.11b: 1, 2, 5.5, 11 Mbps
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 (MCS 0-7)
Modulation N/A DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM
802.11n Features N/A A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS
Transmit Power (±2 dBm) N/A 802.11b: 17 dBm typical
802.11g/n: 15 dBm typical
802.11a: 12 dBm typical
Security N/A WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i
QoS N/A WMM, WMM-PS, 802.11e
Roaming Enhancements N/A 802.11k/r
Extended Range (802.11n) N/A
Radio Certifcations N/A USA, Canada, EU, Japan
Power Requirements1
Typical/Idle 700 mA @ 3.75 V / 200 mA @ 3.75 V
Mechanical
Dimensions (L x W x H) 82 mm x 50 mm x 6.5 mm 82 mm x 50 mm x 8 mm
Module Connectors 2 x 180-pin board-to-board connectors
(Mating connector FCI P/N 61083-184409LF or similar)
Environmental
Operating Temperature -40°C to +85°C (i.MX537, 800 MHz)
-20°C to +70°C (i.MX535, 1000 MHz)
Storage Temperature -40° C up to +85° C (-40° F to +185° F)
Relative Humidity 5% to 90% (non-condensing)
Altitude 12,000 feet (3,658 meters)
Temperature / Climate Tests IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40°C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85°C), IEC 60068-2-78 (Damp heat steady state: 16h with +40°C and 93%rH)
Vibration / Shock Tests IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea
Regulatory Approvals
FCC Part 15 Class B
FCC Part 15 Sub C Section 15.247
IC RSS-210 Issue 5 Section 6.2.2(o)
EN55022:2006 Class B
ICES-003, Class B
VCCI, Class B
EN55024:1998 +A1:2001, A2:2003
EN61000-3-2:2006
EN61000-3-3:1995 +A1:2001, A2:2005
EN60950-1:2001
(UL60950-equivalent)
CSA C22.2, No. 60950

1 Baseline power consumption based on standard use case without WLAN and Ethernet. See Hardware Reference Manual for more detailed information.
2 Contact your local distributor or Digi sales office for details.
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