ConnectCore® i.MX53 / Wi-i.MX53
Freescale i.MX53 Cortex A8 system-on-module
- Integrated secure wireless 802.11a/b/g/n Wi-Fi WLAN
- Integrated Bluetooth 4.0
- Powerful 2D/3D graphics, 1080p video
- Support for Embedded Linux, Microsoft Windows Compact 7 and Android
- Industrial operating temperature system-on-module (SoM)
- Secure, anywhere management using iDigi Manager Pro™
The network-enabled ConnectCore for i.MX53 is a highly integrated and future-proof system-on-module (SoM) solution based on the new Freescale i.MX53 application processor with a high performance 1 GHz ARM Cortex-A8 core, wired and wireless connectivity, powerful 1080p/720p video encoding/decoding capabilities, dual-CAN bus interface and a complete set of peripherals.
The ConnectCore for i.MX53 family builds on the successful ConnectCore for i.MX51 modules by providing a form factor compatible option with significantly improved processing, memory, video and connectivity capabilities. It is a scalable and energy-efficient module family that is ideal for medical devices, security/surveillance equipment, industrial applications, kiosk systems and digital signage integration.
Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by the iDigi® Device Cloud™. This secure, highly-scalable platform seamlessly ties enterprise applications and remote devices together.
The ConnectCore for i.MX53 modules combine industry-leading performance, low power consumption and easy design integration with key features like integrated power management IC, on-chip multimedia support, including multi-format 1080p video hardware decoding, 2D/3D graphics acceleration, dual display/camera interface, hardware encryption engine, 802.11abgn Wi-Fi interface (150 Mbps), Bluetooth 4.0 with HDP support, dual 10/100 Ethernet option, dual-CAN bus, SATA II storage interface and a comprehensive set of additional peripherals.
Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by the iDigi® Device Cloud™. This robust cloud platform makes it easy to configure and manage deployments and integrate devices with virtually any application. Device manufacturers can build secure, highly scalable and cost-effective solutions that seamlessly tie assets to applications, regardless of location.
Complete and cost-efficient Digi JumpStart Kits® for Digi Embedded Linux, Timesys LinuxLink, Android and Microsoft Windows Embedded Compact 7 allow immediate and professional embedded product development with dramatically reduced design risk and time-to-market.
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Featured Models/Part Numbers
| North America: | International: | ||
 ConnectCore for i.MX53 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen
View details |
CC-WMX53-LX |
CC-WMX53-LX |
Contact Us |
|
ConnectCore for i.MX53 JumpStart Kit for Microsoft Windows Embedded Compact 7, 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen
View details |
CC-WMX53-CE |
CC-WMX53-CE |
Contact Us |
|
New - ConnectCore for i.MX53 JumpStart Kit for Android, installation and setup support package, 7" WVGA LCD panel w/touchscreen
View details |
CC-WMX53-ANDRD |
CC-WMX53-ANDRD |
Contact Us |
| Development Kits | North America: | International: | |
| ConnectCore for i.MX53 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen View details |
CC-WMX53-LX |
CC-WMX53-LX |
Contact Us |
| ConnectCore for i.MX53 JumpStart Kit for Microsoft Windows Embedded Compact 7, 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen View details |
CC-WMX53-CE |
CC-WMX53-CE |
Contact Us |
| ConnectCore for i.MX53 JumpStart Kit for Android, installation and setup support package, 7" WVGA LCD panel w/touchscreen View details |
CC-WMX53-ANDRD |
CC-WMX53-ANDRD |
Contact Us |
| Specifications | ConnectCore® i.MX53 | ConnectCore® Wi-i.MX53 |
| Processor | ||
| Processor Model | Freescale® i.MX535/i.MX537 | |
| Speed Grades | 800/1000 MHz | |
| Core Type | ARM® Cortex™-A8 | |
| Cache Memory | 32k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified) | |
| Internal RAM | 128 KB (secure/non-secure) | |
| Vector Floating Point | • | |
| NEON Media Acceleration | • | |
| Memory | ||
| Flash | Up to 8 GB NAND flash | |
| RAM | Up to 2 GB DDR2 | |
| Debug | ||
| Secure JTAG | • | |
| ETM/ETB | • | |
| Power Management | ||
| Power Modes | Run, Wait, Stop, Low-power screen refresh | |
| Wake-up Events | GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach | |
| Dynamic Voltage and Frequency Scaling | • | |
| Backlight Drivers | 3 | |
| Battery Management | • | |
| Real Time Clock | ||
| Battery Backup (External) | • | |
| Security | ||
| Hardware encryption/decryption | AES, DES/3DES, RC4, C2 RSA, ECC MD5, SHA-1/224/256 |
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| Random Number Generator | • | |
| Run Time Integrity Checker | • | |
| Secure RAM (internal) | • | |
| Fuse Box (e-Fuses) | 64 Bits (application-specific use) | |
| Physical Tamper Detectors | • | |
| Timers | ||
| General Purpose Timer | 32-bit up-counter with clock source selection 2 input capture channels 3 output compare channels, forced compare |
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| Enhanced Periodic Interrupt Timer | 32-bit down-counter with clock source selection Set-and-forget/free-running modes Precision interrupt generation |
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| Watchdog | • | |
| Thermal Management | ||
| Temperature Monitor | On-chip sensor, precision 0 to 135°C ±5°C Software support for thermal-aware Dyamic Frequency and Voltage Scaling (DFVS) |
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| Connectivity | ||
| UART | Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support | |
| IrDA Infrared | Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps) | |
| CAN | Up to 2 channels, up to 1 Mbps each, CAN 2.0b | |
| CSPI | Master and slave mode Bit rate up to 25 Mbps (master) |
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| eCSPI | Up to 2 eCSPI channels, master and slave mode, bit rates up to 52 Mbps | |
| I2C | Up to 2 eCSPI channels, master and slave mode Bit rates up to 66.5 Mbps (master) |
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| SD/SDIO/MMC/eMMC | Up to 4 ports, 1-/4-/8-bit modes MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode) eMMC 4.4: Ultra high speed, up to 832 Mbps |
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| I2C | Up to 3 channels, master/slave (7-/10-bit addressing) All: Standard (100 kbps) and fast (400 kbps) mode |
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| P-ATA | Up to 66 MB/s data rate PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5) |
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| SATA | SATA II, up to 1.5 Gbps | |
| USB 2.0 High-Speed | Up to 3 USB 2.0 High-Speed Host ports (one with integrated PHY) Up to 1 USB 2.0 OTG port with integrated PHY |
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| Media Local Bus (MLB) |
MOST (Media Oriented Systems Transport) interface, up to 50 Mbps |
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| 1-Wire | • | |
| ISO 7816 (SIM/Smart Card) | • | |
| Keypad | 8x8 keypad matrix | |
| PWM | 2 | |
| ADC (10-bit) | Up to 4 channels | |
| GPIO | Up to 128 GPIOs | |
| External Memory Bus | 16-bit data/28-bit address in non-multiplexed address/data mode 16-bit or 32-bit data/28-bit address in multiplexed address/data mode |
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| Multimedia | ||
| Camera |
Two parallel camera ports, up to 20-bit, up to 120 MHz peak |
|
| Display |
Five interfaces available. Total rate of all interfaces is up to 180 Mpixels/sec, 24 bpp. Up to two displays can be simultaneously driven directly (screen refresh). Concurrent asyncronous access to two additional devices, e.g. display controllers and smart displays, is supported. Two Parallel 24-bit display ports – up to 165 Mpixels/sec, e.g. UXGA @ 60Hz LVDS serial ports: One port up to 165 Mpixels/sec or two ports up to 85 MP/sec each, e.g. WXGA @ 60Hz One TV-out/VGA port up to 150 Mpixels/sec, e.g. 1080p60 |
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| Image Processing Unit | Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction | |
| Video Processing Unit | MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG 1080p30 decode, 720p30 encode |
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| GPU (2D/3D) | 33 million triangles/sec, 200 million pixels/sec raw OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0 |
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| Touchscreen Interface (4-wire) | • | |
| SPDIF (Tx) | • | |
| I2S/AC97/SSI | Up to 3 channels | |
| ESAI |
Multi-channel digitial audio, up to 1.4 Mbps each channel |
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| ASRC | • | |
| Ethernet | ||
| Physical Layer | 10/100Base-T | |
| Data Rates | 10/100 Mbps, auto-sensing | |
| Duplex Mode | Full or half duplex, auto-sensing | |
| IEEE 1588 | Yes, primary interface only | |
| Power over Ethernet (802.3af) | ||
| Power Over Ethernet | Development board ready for 802.3af PoE application kit (sold separately) | |
| Accelerometer | ||
| Three-Axis Accelerometer | ±2g/±4g/±8g Three-Axis Low-g (Freescale MMA7455L) |
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| Wireless LAN | ||
| Standard | N/A | 802.11a/b/g/n (2.4/5 GHz) |
| Antenna Connectors | N/A | 2 x U.FL |
| Dual Diversity (Receive) | N/A | • |
| Frequency Bands | N/A | 2.412 - 2.484 GHz 4.900 - 5.850 GHz |
| Data Rates | N/A | 802.11b: 1, 2, 5.5, 11 Mbps 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 (MCS 0-7) |
| Modulation | N/A | DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM |
| 802.11n Features | N/A | A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS |
| Transmit Power (±2 dBm) | N/A | 802.11b: 17 dBm typical 802.11g/n: 15 dBm typical 802.11a: 12 dBm typical |
| Security | N/A | WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i |
| QoS | N/A | WMM, WMM-PS, 802.11e |
| Roaming Enhancements | N/A | 802.11k/r |
| Extended Range (802.11n) | N/A | • |
| Radio Certifcations (Pending) | N/A | USA, Canada, EU, Japan |
| Bluetooth (Future Option) | ||
| Bluetooth 2.1 + EDR | N/A | • |
| Bluetooth 3.0 + HS | N/A | • |
| Bluetooth 4.0 w/Bluetooth Low Energy | N/A | • |
| Class | N/A | 1.5 |
| HCI | N/A | • |
| Power Requirements (Preliminary)1 | ||
| Typical/Idle | 700 mA @ 3.75 V / 200 mA @ 3.75 V | |
| Mechanical | ||
| Dimensions (L x W x H) | 82 mm x 50 mm x 6.5 mm | 82 mm x 50 mm x 8 mm |
| Module Connectors | 2 x 180-pin board-to-board connectors (Mating connector FCI P/N 61083-184409LF or similar) |
|
| Environmental | ||
| Operating Temperature | -40°C to +85°C (800 MHz) -20°C to +70°C (1000 MHz) |
|
| Storage Temperature | -50° C to +125° C | |
| Relative Humidity | 5% to 90% (non-condensing) | |
| Altitude | 12,000 feet (3,658 meters) | |
| Temperature / Climate Tests | IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40°C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85°C), IEC 60068-2-78 (Damp heat steady state: 16h with +40°C and 93%rH) | |
| Vibration / Shock Tests | IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea | |
| Regulatory Approvals (Pending) | ||
| FCC Part 15 Class B | • | |
| FCC Part 15 Sub C Section 15.247 | • | |
| IC RSS-210 Issue 5 Section 6.2.2(o) | • | |
| EN55022:2006 Class B | • | |
| ICES-003, Class B | • | |
| VCCI, Class B | • | |
| EN55024:1998 +A1:2001, A2:2003 | • | |
| EN61000-3-2:2006 | • | |
| EN61000-3-3:1995 +A1:2001, A2:2005 | • | |
| EN60950-1:2001 (UL60950-equivalent) |
• | |
| CSA C22.2, No. 60950 | • | |
1 Baseline power consumption based on standard use case without WLAN and Ethernet. See Hardware Reference Manual for more detailed information.
2 Contact your local distributor or Digi sales office for details.
• Module Feature
Feature Specs
- Windows Embedded CE 6.0
- Windows Embedded Compact 7
- Digi Embedded Linux
- Digi Application Development Kit for Android
- Digi ESP
