The network-enabled ConnectCore for i.MX53 is a highly integrated and future-proof system-on-module (SoM) solution based on the new Freescale i.MX53 application processor with a high performance 1 GHz ARM Cortex-A8 core, wired and wireless connectivity, powerful 1080p/720p video encoding/decoding capabilities, dual-CAN bus interface and a complete set of peripherals.
The ConnectCore for i.MX53 family builds on the successful ConnectCore for i.MX51 modules by providing a form factor compatible option with significantly improved processing, memory, video and connectivity capabilities. It is a scalable and energy-efficient module family that is ideal for medical devices, security/surveillance equipment, industrial applications, kiosk systems and digital signage integration.
Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by Device Cloud by Etherios™. This secure, highly-scalable platform seamlessly ties enterprise applications and remote devices together.
The ConnectCore for i.MX53 modules combine industry-leading performance, low power consumption and easy design integration with key features like integrated power management IC, on-chip multimedia support, including multi-format 1080p video hardware decoding, 2D/3D graphics acceleration, dual display/camera interface, hardware encryption engine, 802.11abgn Wi-Fi interface (150 Mbps), Bluetooth 4.0 with HDP support, dual 10/100 Ethernet option, dual-CAN bus, SATA II storage interface and a comprehensive set of additional peripherals.
Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by the Device Cloud. This robust cloud platform makes it easy to configure and manage deployments and integrate devices with virtually any application. Device manufacturers can build secure, highly scalable and cost-effective solutions that seamlessly tie assets to applications, regardless of location.
Complete and cost-efficient Digi JumpStart Kits® for Digi Embedded Linux, Timesys LinuxLink, Android and Microsoft Windows Embedded Compact 7 allow immediate and professional embedded product development with dramatically reduced design risk and time-to-market.
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| North America: | International: | ||
 ConnectCore for i.MX53 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen
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CC-WMX53-LX |
CC-WMX53-LX |
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ConnectCore for i.MX53 JumpStart Kit for Microsoft Windows Embedded Compact 7, 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen
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CC-WMX53-CE |
CC-WMX53-CE |
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 ConnectCore for i.MX53 JumpStart Kit for Android, installation and setup support package, 7" WVGA LCD panel w/touchscreen
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CC-WMX53-ANDRD |
CC-WMX53-ANDRD |
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| Development Kits | North America: | International: | |
| ConnectCore for i.MX53 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen View details |
CC-WMX53-LX |
CC-WMX53-LX |
Contact Us |
| ConnectCore for i.MX53 JumpStart Kit for Microsoft Windows Embedded Compact 7, 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen View details |
CC-WMX53-CE |
CC-WMX53-CE |
Contact Us |
| ConnectCore for i.MX53 JumpStart Kit for Android, installation and setup support package, 7" WVGA LCD panel w/touchscreen View details |
CC-WMX53-ANDRD |
CC-WMX53-ANDRD |
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| Modules | North America: | International: | |
| ConnectCore i.MX53 module, 800MHz, 1GB Flash, 512MB RAM, 1xEthernet, Industrial Temp, single pack View details |
CC-MX-LD6A-ZM |
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| ConnectCore i.MX53 module, 800MHz, 1GB Flash, 512MB RAM, 1xEthernet, Industrial Temp, 25 pack View details |
CC-MX-LD6A-ZM-B |
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| ConnectCore i.MX53 module, 800MHz, 512MB Flash, 1GB RAM, 2xEthernet, Industrial Temp, single pack View details |
CC-MX-LD79-ZK |
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| ConnectCore i.MX53 module, 800MHz, 512MB Flash, 1GB RAM, 2xEthernet, Industrial Temp, 25-piece bulk pack View details |
CC-MX-LD79-ZK-B |
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| ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 512 MB RAM, 2x Ethernet, 802.11abgn, single pack View details |
CC-WMX-KD69-VK |
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| ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 512 MB RAM, 2x Ethernet, 802.11abgn, 25-piece bulk pack View details |
CC-WMX-KD69-VK-B |
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| ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 512 MB RAM, 1x Ethernet, 802.11abgn, single pack View details |
CC-WMX-KD69-VM |
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| ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 512 MB RAM, 1xEthernet, 802.11abgn, 25-piece bulk pack View details |
CC-WMX-KD69-VM-B |
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| ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 1 GB RAM, 2x Ethernet, 802.11abgn, single pack View details |
CC-WMX-KD79-VK |
Contact Us |
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| ConnectCore Wi-i.MX53 module, 1 GHz, 512 MB Flash, 1 GB RAM, 2x Ethernet, 802.11abgn, 25-piece bulk pack View details |
CC-WMX-KD79-VK-B |
Contact Us |
| Specifications | ConnectCore® i.MX53 | ConnectCore® Wi-i.MX53 |
| Processor | ||
| Processor Model | Freescale® i.MX535/i.MX537 | |
| Speed Grades | 800/1000 MHz | |
| Core Type | ARM® Cortex™-A8 | |
| Cache Memory | 32k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified) | |
| Internal RAM | 128 KB (secure/non-secure) | |
| Vector Floating Point | • | |
| NEON Media Acceleration | • | |
| Memory | ||
| Flash | Up to 8 GB NAND flash | |
| RAM | Up to 2 GB DDR2 | |
| Debug | ||
| Secure JTAG | • | |
| ETM/ETB | • | |
| Power Management | ||
| Power Modes | Run, Wait, Stop, Low-power screen refresh | |
| Wake-up Events | GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach | |
| Dynamic Voltage and Frequency Scaling | • | |
| Backlight Drivers | 3 | |
| Battery Management | • | |
| Real Time Clock | ||
| Battery Backup (External) | • | |
| Security | ||
| Hardware encryption/decryption | AES, DES/3DES, RC4, C2 RSA, ECC MD5, SHA-1/224/256 |
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| Random Number Generator | • | |
| Run Time Integrity Checker | • | |
| Secure RAM (internal) | • | |
| Fuse Box (e-Fuses) | 64 Bits (application-specific use) | |
| Physical Tamper Detectors | • | |
| Timers | ||
| General Purpose Timer | 32-bit up-counter with clock source selection 2 input capture channels 3 output compare channels, forced compare |
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| Enhanced Periodic Interrupt Timer | 32-bit down-counter with clock source selection Set-and-forget/free-running modes Precision interrupt generation |
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| Watchdog | • | |
| Thermal Management | ||
| Temperature Monitor | On-chip sensor, precision 0 to 135°C ±5°C Software support for thermal-aware Dyamic Frequency and Voltage Scaling (DFVS) |
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| Connectivity | ||
| UART | Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support | |
| IrDA Infrared | Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps) | |
| CAN | Up to 2 channels, up to 1 Mbps each, CAN 2.0b | |
| CSPI | Master and slave mode Bit rate up to 25 Mbps (master) |
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| eCSPI | Up to 2 eCSPI channels, master and slave mode, bit rates up to 52 Mbps | |
| I2C | Up to 2 eCSPI channels, master and slave mode Bit rates up to 66.5 Mbps (master) |
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| SD/SDIO/MMC/eMMC | Up to 4 ports, 1-/4-/8-bit modes MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode) eMMC 4.4: Ultra high speed, up to 832 Mbps |
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| I2C | Up to 3 channels, master/slave (7-/10-bit addressing) All: Standard (100 kbps) and fast (400 kbps) mode |
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| P-ATA | Up to 66 MB/s data rate PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5) |
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| SATA | SATA II, up to 1.5 Gbps | |
| USB 2.0 High-Speed | Up to 3 USB 2.0 High-Speed Host ports (one with integrated PHY) Up to 1 USB 2.0 OTG port with integrated PHY |
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| Media Local Bus (MLB) |
MOST (Media Oriented Systems Transport) interface, up to 50 Mbps |
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| 1-Wire | • | |
| ISO 7816 (SIM/Smart Card) | • | |
| Keypad | 8x8 keypad matrix | |
| PWM | 2 | |
| ADC (10-bit) | Up to 4 channels | |
| GPIO | Up to 128 GPIOs | |
| External Memory Bus | 16-bit data/28-bit address in non-multiplexed address/data mode 16-bit or 32-bit data/28-bit address in multiplexed address/data mode |
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| Multimedia | ||
| Camera |
Two parallel camera ports, up to 20-bit, up to 120 MHz peak |
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| Display |
Five interfaces available. Total rate of all interfaces is up to 180 Mpixels/sec, 24 bpp. Up to two displays can be simultaneously driven directly (screen refresh). Concurrent asyncronous access to two additional devices, e.g. display controllers and smart displays, is supported. Two Parallel 24-bit display ports – up to 165 Mpixels/sec, e.g. UXGA @ 60Hz LVDS serial ports: One port up to 165 Mpixels/sec or two ports up to 85 MP/sec each, e.g. WXGA @ 60Hz One TV-out/VGA port up to 150 Mpixels/sec, e.g. 1080p60 |
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| Image Processing Unit | Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction | |
| Video Processing Unit | MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG 1080p30 decode, 720p30 encode |
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| GPU (2D/3D) | 33 million triangles/sec, 200 million pixels/sec raw OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0 |
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| Touchscreen Interface (4-wire) | • | |
| SPDIF (Tx) | • | |
| I2S/AC97/SSI | Up to 3 channels | |
| ESAI |
Multi-channel digitial audio, up to 1.4 Mbps each channel |
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| ASRC | • | |
| Ethernet | ||
| Physical Layer | 10/100Base-T | |
| Data Rates | 10/100 Mbps, auto-sensing | |
| Duplex Mode | Full or half duplex, auto-sensing | |
| IEEE 1588 | Yes, primary interface only | |
| Power over Ethernet (802.3af) | ||
| Power Over Ethernet | Development board ready for 802.3af PoE application kit (sold separately) | |
| Accelerometer | ||
| Three-Axis Accelerometer | ±2g/±4g/±8g Three-Axis Low-g (Freescale MMA7455L) |
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| Wireless LAN | ||
| Standard | N/A | 802.11a/b/g/n (2.4/5 GHz) |
| Antenna Connectors | N/A | 2 x U.FL |
| Dual Diversity (Receive) | N/A | • |
| Frequency Bands | N/A | 2.412 - 2.484 GHz 4.900 - 5.850 GHz |
| Data Rates | N/A | 802.11b: 1, 2, 5.5, 11 Mbps 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 (MCS 0-7) |
| Modulation | N/A | DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM |
| 802.11n Features | N/A | A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS |
| Transmit Power (±2 dBm) | N/A | 802.11b: 17 dBm typical 802.11g/n: 15 dBm typical 802.11a: 12 dBm typical |
| Security | N/A | WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i |
| QoS | N/A | WMM, WMM-PS, 802.11e |
| Roaming Enhancements | N/A | 802.11k/r |
| Extended Range (802.11n) | N/A | • |
| Radio Certifcations (Pending) | N/A | USA, Canada, EU, Japan |
| Bluetooth (Future Option) | ||
| Bluetooth 2.1 + EDR | N/A | • |
| Bluetooth 3.0 + HS | N/A | • |
| Bluetooth 4.0 w/Bluetooth Low Energy | N/A | • |
| Class | N/A | 1.5 |
| HCI | N/A | • |
| Power Requirements1 | ||
| Typical/Idle | 700 mA @ 3.75 V / 200 mA @ 3.75 V | |
| Mechanical | ||
| Dimensions (L x W x H) | 82 mm x 50 mm x 6.5 mm | 82 mm x 50 mm x 8 mm |
| Module Connectors | 2 x 180-pin board-to-board connectors (Mating connector FCI P/N 61083-184409LF or similar) |
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| Environmental | ||
| Operating Temperature | -40°C to +85°C (800 MHz) -20°C to +70°C (1000 MHz) |
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| Storage Temperature | -50° C to +125° C | |
| Relative Humidity | 5% to 90% (non-condensing) | |
| Altitude | 12,000 feet (3,658 meters) | |
| Temperature / Climate Tests | IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40°C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85°C), IEC 60068-2-78 (Damp heat steady state: 16h with +40°C and 93%rH) | |
| Vibration / Shock Tests | IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea | |
| Regulatory Approvals | ||
| FCC Part 15 Class B | • | |
| FCC Part 15 Sub C Section 15.247 | • | |
| IC RSS-210 Issue 5 Section 6.2.2(o) | • | |
| EN55022:2006 Class B | • | |
| ICES-003, Class B | • | |
| VCCI, Class B | • | |
| EN55024:1998 +A1:2001, A2:2003 | • | |
| EN61000-3-2:2006 | • | |
| EN61000-3-3:1995 +A1:2001, A2:2005 | • | |
| EN60950-1:2001 (UL60950-equivalent) |
• | |
| CSA C22.2, No. 60950 | • | |
1 Baseline power consumption based on standard use case without WLAN and Ethernet. See Hardware Reference Manual for more detailed information.
2 Contact your local distributor or Digi sales office for details.
• Module Feature
