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How to Approach Embedded Design Challenges the Right Way

April 28, 2020 - 10:00 am CT

Integrated. Scalable. Connected. Discover the faster, smarter path to embedded design success.
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Webinar

How to Approach Embedded Design Challenges the Right Way
Presented by:
Mark Tekippe, Director of Product Management, Digi International
Robert Thompson, Director Global i.MX Ecosystem, NXP

April 28, 2020 - 10:00 am CT

Integrated. Scalable. Connected. Discover the faster, smarter path to embedded design success.

Join experts from Digi and NXP to learn new ways of overcoming the most frustrating embedded design obstacles developers face. Whether you are designing products for industrial, medical or transportation markets, Digi ConnectCore® system-on-modules, rich software and expert support provide a complete toolkit for building a variety of real-world applications. Register today, attend the webinar and complete a short questionnaire to qualify for a free, 30-minute project collaboration with a Digi embedded design expert to help you determine the best development pathway for your product.

Digi’s key objective when developing new embedded solutions is to help organizations accelerate the development, deployment and management of secure, connected products. During this informative, 20-minute webinar followed by Q&A, you’ll learn about the ways NXP’s portfolio of i.MX applications processors and Digi’s “hardware-enabled, software-defined” system-on-module strategy provide the solutions to solve complex embedded design challenges.

During this webinar you will discover answers to the questions embedded design engineers most frequently encounter:

  • What type of module is the best fit for my application?
  • Will this be scalable and keep up with market requirements?
  • What can I do to prevent systems integration bugs and update issues?
  • How can I ensure data security?
  • How can I meet the project budget and timeline?
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