| General |
| Processor Type |
32-bit Digi NS9210 processor |
| ARM Core |
ARM926EJ-S |
| Processor Speed |
75 MHz |
| Cache |
4k I/D Cache |
| Memory Base Population |
Support up to 8 MB NOR Flash
Support up to 16 MB SDRAM |
| Flexible Interface Modules (FIMs) |
300 MHz DRPIC165X CPU
2k program/192 bytes data RAM |
| On-chip 256-bit AES Accelerator |
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| Power Management Modes |
On-the-fly clock scaling
Low-power sleep modes
Configurable scaling/wake-up events
(EIRQ, UART, Ethernet, etc.) |
| Pins/Form Factor |
RJ-45 connector style with 20-pin micro pin header (Samtec FTS-110-01-F-DV-TR) |
| High-Speed TTL Serial Interface |
Full signal support
(TXD, RXD, RTS, CTS, DTR, DSR and DCD)
Hardware/Software flow control |
| GPIO |
10 shared
Up to 3 external IRQ options |
| SPI |
Master data rate up to 16.7 Mbps
Slave data rate up to 7.5 Mbps |
| I2C |
v1.0 bus interface
7-bit and 10-bit address modes |
| Flexible Interface Support (FIM) |
UART, 1-Wire, USB device (low-speed), CAN BUS |
| Watchdog Timer (16-bit) |
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| JTAG Interface |
Available on development modules only |
| On-Board Power Supervisor |
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| Wave-Solderable Design |
No clean flux process |
| Dimensions (L x W x H) |
1.445 in (36.7 mm) x 0.75 in (19.05 mm) x 0.735 in (18.67 mm) |
| Network Interface – Wireless LAN |
| Standard |
IEEE 802.11 b/g/n |
| Frequency |
2.4 GHz |
| Data Rate |
Up to 65Mbps with automatic fallback |
| Modulation |
CCK (11/5 Mbps), DQPSK (2 Mbps), DBPSK (1 Mbps), OFDM (6, 9, 12, 18, 24, 48, 54 and 65 Mbps) |
| Typical Transmit Power |
+17dBm |
| Receive Sensitivity |
-69dBm @ 54 Mbps |
| Connector |
1 x RP-SMA |
| WLAN Security |
| WEP (Wired Equivalent Privacy) |
64/128-bit encrycption (RC4) |
| WPA/WPA2/802.11i |
128-bit TKIP/CCMP (AES) encryption.
Enterprise mode (802.1X): LEAP (WEP only), PEAP, TTLS, TLS,
EAP-FAST, GTC, MD5, OTP, PAP, CHAP, MSCHAP, MSCHAPv2, TTLS-MSCHAPv2.
Pre-shared key mode (PSK/Personal). |
| Environmental |
| Operating Temperature |
-40° C to +75° C (-40° F to +167° F) -40° C to +85° C (-40° F to +185° F) with external thermal pad* |
| Storage Temperature |
-50° C to +125° C (-58° F to +257° F) |
| Relative Humidity |
5% to 90% (non-condensing) |
| Altitude |
12,000 feet (3,658 meters) |
| Power Requirements (3.3VDC) |
| Maximum |
450 mA (1.485 W) |
| Typical |
346 mA (1.14 W)
UART and Ethernet activated |
| Idle |
186 mA (613 mW)
/16 clock scaling, Ethernet activated |
| Sleep |
34 mA (113 mW)
Wake-up on EIRQ, Ethernet PHY off |
| Regulatory Approvals |
| FCC Part 15 Class B, EN 55022 Class B |
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| EN 61000-3-2 and EN 61000-3-3 |
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| ICES-003 Class B, VCCI Class II, AS 3548 |
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| FCC Part 15 Sub C Section 15.247 |
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| IC RSS-210 Issue 5 Section 6.2.2(o) |
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| EN 300 328, EN 301 489-17 |
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| UL 60950-1, EN 60950 (EU) |
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| CSA C22.2, No. 60950 |
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| EN 55024 |
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| Intentional Radiation |
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