ConnectCore® i.MX51 / Wi-i.MX51

Freescale i.MX51 Cortex A8 SoM

How to Buy

The network-enabled ConnectCore Wi-i.MX51 is a highly integrated and future-proof system-on-module (SoM) solution based on the Freescale i.MX51 application processor with a high performance 600/800 MHz ARM Cortex-A8 core, powerful multimedia capabilities and a complete set of peripherals. It is the ideal choice for a broad range of target markets/applications including medical, digital signage, security/surveillance, access control, retail, industrial/building automation, transportation, traffic control, utilities/energy and more.

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The ConnectCore Wi-i.MX51 combines industry-leading performance, low power consumption and industrial operating temperature. Design integration is easy with key features like on-chip multimedia support, including multi-format 720P/30 fps video hardware decoding and 2D/3D graphics acceleration, dual-display interface, hardware encryption engine, 802.11abgn Wi-Fi interface, dual 10/100 Ethernet option and a comprehensive set of peripherals.

Modules in the ConnectCore i.MX embedded system-on-module family feature the design, development and administrative advantages offered by Device Cloud. This robust cloud platform makes it easy to configure and manage deployments and integrate devices with virtually any application. Device manufacturers can build secure, highly scalable and cost-effective solutions that seamlessly tie assets to applications, regardless of location.

Complete and cost-efficient Digi JumpStart Kits for Microsoft Windows Embedded CE 6.0 R3, Microsoft Windows Embedded Compact 7, Timesys Linux, and Digi Embedded Linux allow immediate and professional embedded product development with dramatically reduced design risk and time-to-market. Additional support for Yocto Embedded Linux is also available for download.

Digi was an enabling partner in the whole development process, and as a start-up company, partnering with companies like Digi is critical for our success.

James Paterson, Eykona co-founder

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Digi Device Cloud
Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by Digi Device Cloud. This secure, highly-scalable platform seamlessly ties enterprise applications and remote devices together.
Specifications ConnectCore i.MX51 ConnectCore Wi-i.MX51
Processor Model Freescale® i.MX51
Speed Grades 600/800 MHz
Core Type ARM® Cortex™-A8
Cache Memory 32 k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified)
Internal RAM 128 KB (secure/non-secure)
Vector Floating Point
NEON Media Acceleration
Flash Up to 8 GB NAND flash
RAM Up to 512 MB DDR2
Secure JTAG
Power Management
Power Modes Run, Wait, Stop, Low-power screen refresh
Wake-up Events GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach
Dynamic Voltage and Frequency Scaling
Backlight Drivers 3
Battery Management
Real Time Clock
Battery Backup
Hardware encryption/decryption AES, DES/3DES, RC4, C2
MD5, SHA-1/224/256
Random Number Generator
Run Time Integrity Checker
Secure RAM (internal)
Fuse Box (e-Fuses) 64 Bits (application-specific use)
Physical Tamper Detectors
General Purpose Timer 32-bit up-counter with clock source selection
2 input capture channels
3 output compare channels, forced compare
Enhanced Periodic Interrupt Timer 32-bit down-counter with clock source selection
Set-and-forget/free-running modes
Precision interrupt generation
UART Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support
IrDA Infrared Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps)
CSPI Master and slave mode
Bit rate up to 25 Mbps (master)
eCSPI Up to 2 eCSPI channels, master and slave mode
Bit rates up to 66.5 Mbps (master)
I2C Up to 3 channels, master/slave (7-/10-bit addressing)
All: Standard (100 kbps) and fast (400 kbps) mode
SD/SDIO/MMC Up to 4 ports, 1-/4-/8-bit modes
MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode)
P-ATA Up to 66 MB/s data rate
PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5)
USB 2.0 High-Speed Up to 3 USB 2.0 High-Speed Host ports (transceiver-less)
Up to 1 USB 2.0 OTG port with PHY
ISO 7816 (SIM/Smart Card)
Keypad 8x8 keypad matrix
ADC (10-bit) Up to 4 channels
GPIO Up to 128 GPIOs
External Memory Bus 16-bit data/28-bit address in non-multiplexed address/data mode
16-bit or 32-bit data/28-bit address in multiplexed address/data mode
Camera 2 camera ports
Bayer RGB, Full RGB, YUV 4:4:4, YUV 4:2:2, Gray scale, Generic data
Parallel interface (up to 522 Mbps) or fast serial interface (up to 1.44 Gbps)
Fast serial: Up to 6M pixels @ 15 fps (Bayer), Parallel: Up to 8M pixels @ 15 fps (Bayer)
Window-of-interest selection, frame rate reduction, color depth reduction
Display Primary and secondary display support / TV out (SD/HD)
Up to 24-bit color depth, software contrast control
Up to XGA (1024x768) @ 100 fps/720p (1280x720) @ 60 fps/1080i (1920x1080) @ 30 fps
3-/4-/5-wire serial interface, parallel, parallel bidirectional, DSI (4 lanes/4 channels)
Image Processing Unit Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction
Video Processing Unit MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG
GPU (2D/3D) 27 million triangles/sec, 166 million pixels/sec raw
OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0
Touchscreen Interface (4-wire)
I2S/AC97/SSI Up to 3 channels
Physical Layer 10/100Base-T
Data Rates 10/100 Mbps, auto-sensing
Duplex Mode Full or half duplex, auto-sensing
Power over Ethernet (802.3af)
Power Over Ethernet Development board ready for 802.3af PoE application kit (sold separately)
Three-Axis Accelerometer ±2g/±4g/±8g Three-Axis Low-g
Freescale MA7455L
Wireless LAN
Standard N/A 802.11a/b/g/n
Antenna Connectors N/A 2 x U.FL
Dual Diversity N/A
Frequency Bands N/A 2.412 - 2.484 GHz
N/A 4.900 - 5.850 GHz
Data Rates N/A 802.11b: 1, 2, 5.5, 11 Mbps
N/A 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
N/A 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps (MCS 0-7)
Modulation N/A DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM
802.11n Features N/A A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS
Transmit Power (±2 dBm) N/A 802.11b: 17 dBm typical
N/A 802.11g/n: 15 dBm typical
N/A 802.11a/n: 12 dBm typical
Security N/A WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i
QoS N/A WMM, WMM-PS, 802.11e
Roaming Enhancements N/A 802.11k/r
Extended Range (802.11n) N/A
Radio Certifcations (Pending) N/A USA, Canada, EU, Japan
Power Requirements (w/o Ethernet and Wi-Fi)+
Typical1 700 mA @ 3.75 V
Idle1 200 mA @ 3.75 V
Module Population Options2
Processor Speed Grade
Memory (Flash/RAM)
Network Interfaces Single 10/100 Ethernet, dual 10/100 Ethernet, 802.11a/b/g/n WLAN
Dimensions (L x W x H) 82 mm x 50 mm x 6.5 mm 82 mm x 50 mm x 8 mm
Module Connectors 2 x 180-pin board-to-board connectors, 0.8 mm pitch
(Mating connector FCI P/N 61083-184409LF or similar)
Operating Temperature -40° C to +85° C (600 MHz)
-20° C to +85° C (800 MHz)
Storage Temperature -40° C up to +85° C (-40° F to +185° F)
Relative Humidity 5% to 90% (non-condensing)
Altitude 12,000 feet (3,658 meters)
Temperature/Climate Tests IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40° C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85° C), IEC 60068-2-78 (Damp heat steady state: 16h with +40° C and 93% rH)
Shock/Vibration Tests IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea
Regulatory Approvals (Pending)
FCC Part 15 Class B
FCC Part 15 Sub C Section 15.247
IC RSS-210 Issue 5 Section 6.2.2(o)
EN55022:2006 Class B
ICES-003, Class B
VCCI, Class B
EN55024:1998 +A1:2001, A2:2003
EN61000-3-3:1995 +A1:2001, A2:2005
CSA C22.2, No. 60950

1 Baseline power consumption based on standard use case without WLAN and Ethernet. See Hardware Reference Manual for more detailed information.
2 Contact your local distributor or Digi sales office for details.
• Module feature

ConnectCore® Wi-i.MX51 - Side

ConnectCore® Wi-i.MX51 - Bottom


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