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ConnectCore® i.MX51 / Wi-i.MX51

Freescale i.MX51 Cortex A8 system-on-module (SoM)

iDigi
  • Integrated secure wireless 802.11abgn Wi-Fi LAN
  • Powerful 2D/3D graphics and 720p video
  • Embedded Linux, Windows Compact 7 and Windows CE 6.0 support
  • Industrial operating temperature system-on-module
  • Secure anywhere management using iDigi Manager Pro™

The network-enabled ConnectCore Wi-i.MX51 is a highly integrated and future-proof system-on-module (SoM) solution based on the Freescale i.MX51 application processor with a high performance 600/800 MHz ARM Cortex-A8 core, powerful multimedia capabilities and a complete set of peripherals. It is the ideal choice for a broad range of target markets/applications including medical, digital signage, security/surveillance, access control, retail, industrial/building automation, transportation, traffic control, utilities/energy and more.

The ConnectCore Wi-i.MX51 combines industry-leading performance, low power consumption and industrial operating temperature. Design integration is easy with key features like on-chip multimedia support, including multi-format 720P/30 fps video hardware decoding and 2D/3D graphics acceleration, dual-display interface, hardware encryption engine, 802.11abgn Wi-Fi interface, dual 10/100 Ethernet option and a comprehensive set of peripherals.

Modules in the ConnectCore i.MX embedded system-on-module family feature the design, development and administrative advantages offered by the iDigi® Device Cloud™. This robust cloud platform makes it easy to configure and manage deployments and integrate devices with virtually any application. Device manufacturers can build secure, highly scalable and cost-effective solutions that seamlessly tie assets to applications, regardless of location.

Complete and cost-efficient Digi JumpStart Kits for Microsoft Windows Embedded CE 6.0 R3, Microsoft Windows Embedded Compact 7 (coming soon), Timesys Linux and Digi Embedded Linux allow immediate and professional embedded product development with dramatically reduced design risk and time-to-market.

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Featured Models/Part Numbers

  North America: International:  
New - ConnectCore for i.MX51 JumpStart Kit for Windows Embedded CE 6.0R3 and Windows Embedded Compact 7, 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen
View details 
CC-WMX51-CE
CC-WMX51-CE

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ConnectCore for i.MX51 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen
View details 
CC-WMX51-LX
CC-WMX51-LX

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New - ConnectCore for i.MX51 Development Kit for Timesys LinuxLink, 7" WVGA LCD panel with touchscreen
View details 
CC-WMX51-LL
CC-WMX51-LL

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Digi JumpStart Kits North America: International:  
ConnectCore for i.MX51 JumpStart Kit for Windows Embedded CE 6.0R3 and Windows Embedded Compact 7, 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen
View details 
CC-WMX51-CE
CC-WMX51-CE

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ConnectCore for i.MX51 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen
View details 
CC-WMX51-LX
CC-WMX51-LX

Contact Us
ConnectCore for i.MX51 Development Kit for Timesys LinuxLink, 7" WVGA LCD panel with touchscreen
View details 
CC-WMX51-LL
CC-WMX51-LL

Contact Us
Specifications ConnectCore® i.MX51 ConnectCore® Wi-i.MX51
Processor
Processor Model Freescale® i.MX51
Speed Grades 600/800 MHz
Core Type ARM® Cortex™-A8
Cache Memory 32 k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified)
Internal RAM 128 KB (secure/non-secure)
Vector Floating Point
NEON Media Acceleration
Memory
Flash Up to 8 GB NAND flash
RAM Up to 512 MB DDR2
Debug
Secure JTAG
ETM/ETB
Power Management
Power Modes Run, Wait, Stop, Low-power screen refresh
Wake-up Events GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach
Dynamic Voltage and Frequency Scaling
Backlight Drivers 3
Battery Management
Real Time Clock
Battery Backup
Security
Hardware encryption/decryption AES, DES/3DES, RC4, C2
RSA, ECC
MD5, SHA-1/224/256
Random Number Generator
Run Time Integrity Checker
Secure RAM (internal)
Fuse Box (e-Fuses) 64 Bits (application-specific use)
Physical Tamper Detectors
Timers
General Purpose Timer 32-bit up-counter with clock source selection
2 input capture channels
3 output compare channels, forced compare
Enhanced Periodic Interrupt Timer 32-bit down-counter with clock source selection
Set-and-forget/free-running modes
Precision interrupt generation
Watchdog
Connectivity
UART Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support
IrDA Infrared Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps)
CSPI Master and slave mode
Bit rate up to 25 Mbps (master)
eCSPI Up to 2 eCSPI channels, master and slave mode
Bit rates up to 66.5 Mbps (master)
I2C Up to 3 channels, master/slave (7-/10-bit addressing)
All: Standard (100 kbps) and fast (400 kbps) mode
SD/SDIO/MMC Up to 4 ports, 1-/4-/8-bit modes
MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode)
P-ATA Up to 66 MB/s data rate
PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5)
USB 2.0 High-Speed Up to 3 USB 2.0 High-Speed Host ports (transceiver-less)
Up to 1 USB 2.0 OTG port with PHY
1-Wire
ISO 7816 (SIM/Smart Card)
Keypad 8x8 keypad matrix
PWM 2
ADC (10-bit) Up to 4 channels
GPIO Up to 128 GPIOs
External Memory Bus 16-bit data/28-bit address in non-multiplexed address/data mode
16-bit or 32-bit data/28-bit address in multiplexed address/data mode
Multimedia
Camera 2 camera ports
Bayer RGB, Full RGB, YUV 4:4:4, YUV 4:2:2, Gray scale, Generic data
Parallel interface (up to 522 Mbps) or fast serial interface (up to 1.44 Gbps)
Fast serial: Up to 6M pixels @ 15 fps (Bayer), Parallel: Up to 8M pixels @ 15 fps (Bayer)
Window-of-interest selection, frame rate reduction, color depth reduction
Display Primary and secondary display support / TV out (SD/HD)
Up to 24-bit color depth, software contrast control
Up to XGA (1024x768) @ 100 fps/720p (1280x720) @ 60 fps/1080i (1920x1080) @ 30 fps
3-/4-/5-wire serial interface, parallel, parallel bidirectional, DSI (4 lanes/4 channels)
Image Processing Unit Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction
Video Processing Unit MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG
GPU (2D/3D) 27 million triangles/sec, 166 million pixels/sec raw
OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0
Touchscreen Interface (4-wire)
SPDIF (Tx)
I2S/AC97/SSI Up to 3 channels
Ethernettd>
Physical Layer 10/100Base-T
Data Rates 10/100 Mbps, auto-sensing
Duplex Mode Full or half duplex, auto-sensing
Power over Ethernet (802.3af)
Power Over Ethernet Development board ready for 802.3af PoE application kit (sold separately)
Accelerometer
Three-Axis Accelerometer ±2g/±4g/±8g Three-Axis Low-g
Freescale MA7455L
Wireless LAN
Standard N/A 802.11a/b/g/n
Antenna Connectors N/A 2 x U.FL
Dual Diversity N/A
Frequency Bands N/A 2.412 - 2.484 GHz
N/A 4.900 - 5.850 GHz
Data Rates N/A 802.11b: 1, 2, 5.5, 11 Mbps
N/A 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
N/A 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps (MCS 0-7)
Modulation N/A DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM
802.11n Features N/A A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS
Transmit Power (±2 dBm) N/A 802.11b: 17 dBm typical
N/A 802.11g/n: 15 dBm typical
N/A 802.11a/n: 12 dBm typical
Security N/A WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i
QoS N/A WMM, WMM-PS, 802.11e
Roaming Enhancements N/A 802.11k/r
Extended Range (802.11n) N/A
Radio Certifcations (Pending) N/A USA, Canada, EU, Japan
Power Requirements (w/o Ethernet and Wi-Fi)+
Typical1 700 mA @ 3.75 V
Idle1 200 mA @ 3.75 V
Module Population Options2
Processor Speed Grade
Memory (Flash/RAM)
Network Interfaces Single 10/100 Ethernet, dual 10/100 Ethernet, 802.11a/b/g/n WLAN
Mechanical
Dimensions (L x W x H) 82 mm x 50 mm x 6.5 mm 82 mm x 50 mm x 8 mm
Module Connectors 2 x 180-pin board-to-board connectors, 0.8 mm pitch
(Mating connector FCI P/N 61083-184409LF or similar)
Environmental
Operating Temperature -40° C to +85° C (600 MHz)
-20° C to +70° C (800 MHz)
Storage Temperature -50° C to +125° C
Relative Humidity 5% to 90% (non-condensing)
Altitude 12,000 feet (3,658 meters)
Temperature/Climate Tests IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40° C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85° C), IEC 60068-2-78 (Damp heat steady state: 16h with +40° C and 93% rH)
Shock/Vibration Tests IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea
Regulatory Approvals (Pending)
FCC Part 15 Class B
FCC Part 15 Sub C Section 15.247
IC RSS-210 Issue 5 Section 6.2.2(o)
EN55022:2006 Class B
ICES-003, Class B
VCCI, Class B
EN55024:1998 +A1:2001, A2:2003
EN61000-3-2:2006
EN61000-3-3:1995 +A1:2001, A2:2005
EN60950-1:2001
(UL60950-equivalent)
CSA C22.2, No. 60950

1 Baseline power consumption based on standard use case without WLAN and Ethernet. See Hardware Reference Manual for more detailed information.
2 Contact your local distributor or Digi sales office for details.
• Module feature

ConnectCore™ Wi-i.MX51 - Side

ConnectCore™ Wi-i.MX51 - Bottom

Product Literature

Feature Specs

Support Documentation



 

 

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