FEATURES |
APPLICATION PROCESSOR |
NXP i.MX6UL-2, ARM® Cortex®-A7 at 528 MHz, 128 KB L2 cache, with NEON™ MPE (Media Processor Engine) co-processor and programmable smart DMA (SDMA) controller |
MEMORY |
256 MB / 512 MB / 1 GB NAND flash, 256 MB / 512 MB / 1 GB DDR3 |
PMIC |
NXP PF3000 |
VIDEO/GRAPHICS |
2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8- /16- /18- /24-bit parallel LCD Display up to WXGA (1366x768), 8- /10- /16- /24-bit Parallel CSI with BT.656 support |
SECURITY** |
AIS-31 compliant TRNG, ECC/AES256/TDES/ RSA encryption/decryption co-processor, SHA-1/224/256, FameXE PKI co-processor with 4096-bit RSA,/544-bit ECC/ ECDSA support, Secure RTC, Secure JTAG, Secure Storage, Secure Key Management, SPA/DPA/DFA (power/timing/fault attack protection), Tamper Monitor, Digi TrustFence® Embedded Security Framework |
PERIPHERALS/INTERFACES |
1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs |
EXTERNAL BUS |
16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes) |
ETHERNET |
Dual 10/100 Mbit Ethernet MAC + IEEE 1588 |
WIRELESS |
802.11a/b/g/n/ac 1x1 (MCS 0-9), Bluetooth 5 with strong WPA2-Enterprise authentication/encryption for Wi-Fi connections |
MCA™ MICROCONTROLLER ASSIST |
Ultra-low power ARM® Cortex®-M0+, up to 48 MHz (NXP Kinetis KL03: KL03P24M48SF0) |
OPERATING TEMPERATURE |
Industrial: -40 °C to 85 °C (-40 °F to 185 °F); depending on use case and enclosure/system design |
STORAGE TEMPERATURE |
-50 °C to 125 °C (-58 °F to 257 °F) |
RELATIVE HUMIDITY |
Relative humidity 5% to 90% (non-condensing) |
RADIO APPROVALS |
US, Canada, EU, Japan, Australia/New Zealand, Brazil |
EMISSIONS / IMMUNITY / SAFETY |
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent) |
DESIGN VERIFICATION |
Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78; vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
MOUNTING / PIN COUNT |
Common Digi SMTplus* surface mount footprint using 76-pad edge castellated pads (1.27 mm pitch) or 245-pad LGA (1.27 mm pitch) option |
MECHANICAL DIMENSIONS |
29 mm x 29 mm x 3.5 mm (1.14 in x 1.14 in x 0.14 in) |
POWER CONSUMPTION |
Idle Mode (Linux up, no networking): 100 mA at 5V
Idle Mode (Linux up, with 25% Wi-Fi transmit): 118 mA at 5V
Standby Mode (w/memory refresh): 6 mA at 5V |
ULTRA LOW-POWER MODES |
Event Trigger Mode: 2.5 µA at 3V (i.MX6UL off, MCA LLS w/HS Comparator active)
Scheduled Wake-Up Mode: 2.5 µA at 3V (i.MX6UL off, MCA LLS w/HS Comparator active) |
MAXIMUM RADIO-FREQUENCY POWER |
63.1 mW |
OPERATING FREQUENCY BAND |
2402 - 2480 MHz; 5.250 - 5.350 GHz; 5.470 - 5.725 GHz |
PRODUCT WARRANTY |
3-year |