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ConnectCard™ for i.MX28

Compact wired and wireless core module

Device Cloud by Etherios
  • Cost-effective design in compact form factor
  • 32-bit ARM processor at up to 454 MHz
  • Single/dual 10/100 Ethernet connectivity options
  • Pre-approved 802.11a/b/g/n Wi-Fi + Bluetooth 4.0
  • Support for Digi Embedded Linux, Android and Yocto Project Linux
  • Secure, anywhere management using Device Cloud
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The ConnectCard for i.MX28 is a solution-on-module based on the Freescale i.MX28 processor family. It is an ideal embedded platform solution for connected applications in medical and healthcare, energy/solar, transportation and industrial/building automation.

Offering wired and wireless connectivity, the ConnectCard for i.MX28 offers easy design integration and unique peripheral/interface flexibility in an extremely compact and cost-effective form factor suitable for a wide range of different devices, including battery powered product designs.Device Cloud

ConnectCard modules feature the design, development and administrative advantages offered by Device Cloud by Etherios™. This secure, highly-scalable platform seamlessly ties enterprise applications and remote devices together.

Device Cloud empowers IT, network operations and customer support organizations to conquer the challenges of managing equipment in their device networks. Network managers can remotely configure, upgrade, monitor and troubleshoot remote devices, and create applications that improve productivity, speed and efficiency.

Minimize risk with Digi Software Development Support
Our software support services significantly improve time-to-market by providing experienced software design engineers who can provide programming support, code consultation, and trouble shooting for many of the current development environments including but not limited to: Python, Java, Android, C/C++, and C#. Learn more.

The ConnectCard i.MX28 module is equipped with a highly integrated 32-bit ARM core running at up to 454 MHz, on-chip power management, dual Ethernet and 802.11abgn networking options, Bluetooth 4.0 connectivity, dual FlexCAN options, GPIO, ADC, UART, USB high-speed, SPI, I2C, I2S, 1-Wire, PWM, and JTAG/ETM.

Digi JumpStart Kits for Digi Embedded Linux and Android provide a complete turnkey embedded development solution allowing immediate product development with significantly accelerated time-to-market and reduced design risk. Additional support for Yocto Embedded Linux is also available for download.

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Featured Models/Part Numbers

  North America: International:  
New - ConnectCard for i.MX28 JumpStart Kit for Digi Embedded Linux, installation and setup support package
View details
CC-WMX28-LX
CC-WMX28-LX
BUY ONLINE
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New - ConnectCore for i.MX28 JumpStart Kit for Android 4.0 (ICS), installation and setup support package, 7" WVGA LCD panel w/capactive touchscreen
View details
CC-WMX28-ANDRD
CC-WMX28-ANDRD
BUY ONLINE
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7" WVGA LCD application kit w/resistive touch screen for ConnectCore for i.MX51/i.MX53 and ConnectCard for i.MX28 family
View details
CC-ACC-LCDW-70
CC-ACC-LCDW-70
BUY ONLINE
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Development Kits North America: International:  
ConnectCard for i.MX28 JumpStart Kit for Digi Embedded Linux, installation and setup support package
View details
CC-WMX28-LX
CC-WMX28-LX BUY ONLINE
Contact Us
ConnectCore for i.MX28 JumpStart Kit for Android 4.0 (ICS), installation and setup support package, 7" WVGA LCD panel w/capactive touchscreen
View details
CC-WMX28-ANDRD
CC-WMX28-ANDRD BUY ONLINE
Contact Us
Accessories North America: International:  
7" WVGA LCD application kit w/resistive touch screen for ConnectCore for i.MX51/i.MX53 and ConnectCard for i.MX28 family
View details
CC-ACC-LCDW-70
CC-ACC-LCDW-70 BUY ONLINE
Contact Us
Specifications ConnectCard™ i.MX28 ConnectCard™ Wi-i.MX28
Processor
Processor Models Freescale® i.MX280, i.MX287
Speed Grade Up to 454 MHz
Core Type ARM926EJ-S
Cache Memory 16k I-Cache, 32k D-Cache
Internal RAM 128 KB SRAM
Internal ROM (OCOTP) 1,280 Bits
Memory
Flash Up to 2 GB NAND flash
RAM Up to 256 MB DDR2
Debug
JTAG
ETM/ETB
Power Management
Power Modes Run, Standby, Deep Sleep
Wake-up Events RTC, GPIO, CAN, USB, Ethernet
Auto Slow
Li-Ion Battery Charger / Monitor
Clock and Watchdog
Real-Time Clock
Alarm
Watchdog
Security
Data Co-Processor (DCP) 128-bit AES encryption
SHA-1 / SHA256 hashing
Fusebox (OCOTP) 1280 bits
High-Assurance Boot (HAB4)
Secure Boot 128-bit AES decryption
Peripherals
UART Up to 4 channels with bit rates up to 3.25 Mbps (AUART)
Up to 1 channel with bit rate up to 115 kbps (DUART)
CAN Bus Up to 2 channels, CAN Bus 2.0B, bit rates up to 1 Mbps, 64 message buffers (0-8 bytes),
low-power modes with wake-up
SPI Up to 2, master/slave modes
I2S Up to 1
I2C Up to 2 channels, master/slave (7-/10-bit addressing),
standard (100 kbps) and fast (400 kbps) mode
SD/SDIO/MMC Up to 4 ports, 1-/4-/8-bit modes, up to 48 MHz
USB 2.0 High-Speed Up to 1 USB 2.0 High-Speed Host (with PHY)
Up to 1 USB 2.0 OTG port (with PHY)
1-Wire (optional) Maxim DS2482-100+
GPIO Up to 32 (depending on module variant)
PWM Up to 4
ADC HSADC: Up to 1 channel, up to 2 Mbps sample rate, 8-/10-/12-bit resolution
LRADC: Up to 6 channels, 12-bit resolution
GPIO Up to 128 GPIOs, selectable voltage (1.8/3.3V), interrupt capable
Display
Resolution 800x480 (WVGA)
Refresh Rate Up to 60 Hz
Color Depth 8/16/24 bpp
Modes RGB/DOTCK/SYSTEM
Color Space Conversion
Scaling
Rotation
Touch Screen
Touch Screen Controller 4-/5-wire (LRADC)
Ethernet
Physical Layer 10/100Base-T
Data Rates 10/100 Mbps, auto-sensing
Duplex Mode Full or half duplex, auto-sensing
IEEE 1588 • (i.MX287 only)
Power over Ethernet (802.3af)
Power over Ethernet Development board ready for 802.3af PoE application kit (sold separately)
Wi-Fi2
Standard N/A 802.11a/b/g/n
Antenna Connectors N/A 2 x U.FL
Dual Diversity N/A
Frequency Bands N/A
 
2.412 - 2.484 GHz
4.900 - 5.850 GHz
Data Rates N/A
 
802.11b: 1, 2, 5.5, 11 Mbps
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps
(HT40, MCS 0-7)
Modulation N/A DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM
Transmit Power (±2 dBm) N/A
 
802.11b: 10.5 dBm typical
802.11g/n: 11 dBm typical
802.11a/n: 13 dBm typical
Security N/A WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i
Wi-Fi Logo Certification N/A Ready
CCXv4 ASD N/A Ready
Bluetooth2
Modes N/A Bluetooth 4.0 (Bluetooth 2.1 + EDR, Bluetooth 3.0 + HS 802.11 AMP, Bluetooth Low Energy)
Class N/A 1.5
Profiles N/A GAP, SPP, HSP, HFP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP
Coexistence N/A
Power Requirements (Use-Case Estimates)
Wi-Fi 2.4 GHz Transmit, CPU 454 MHz, 50%, UART active 475mA @ 5V
Wi-Fi 2.4 GHz Receive,
CPU Idle (Auto Slow)
325mA @ 5V
Wi-Fi Standby (Sleep),
CPU Standby (IRQ)
45mA @ 5V
Wi-Fi Standby (Host off),
CPU Deep Sleep (RTC)
1.2mA @ 5V
Module Variants1
Population Options Processor models (i.MX280, i.MX281, i.MX283, i.MX285, i.MX286, i.MX287), flash, RAM, Single 10/100 Ethernet, dual 10/100 Ethernet w/1588, 802.11a/b/g/n Wi-Fi with Bluetooth 4.0,
1-Wire, LCD connector, CAN bus
Mechanical
Dimensions (L x W x H) w/o JTAG/LCD connector 51 mm x 35 mm x 2.6 mm 51 mm x 35 mm x 3 mm
Mating Connector for Module Molex, P/N 67910-5700
Tyco, P/N 2041119-x
Retaining Clip for Module (Optional) Molex, P/N 480995701
Tyco, P/N 1717832
JTAG/LCD Connector on Module (Optional) FCI, P/N SFV31R-1STE1LF
Tyco, P/N 3-1734839-1
Environmental
Operating Temperature -40° C up to +85° C (-40° F to +185° F)
Upper temperature ceilings may require active and/or passive thermal management
such as lower clock speed, thermal pads, airflow, etc.
Storage Temperature -40° C up to +85° C (-40° F to +185° F)
Relative Humidity 5% to 90% (non-condensing)
Altitude 12,000 feet (3,658 meters)
Approvals and Certifications
Emissions FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B,
VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada),
RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17
Immunity EN 55024, EN 301 489-3
Safety UL/UR, or equivalent
Radio US, Canada, EU, Japan, Australia/New Zealand
Temperature IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27
Design Test HALT

1 All options available on development module. Production modules may require custom variants. Contact your local distributor or Digi sales office for details.

2
Transmit power and channel availability depending on regulatory requirements and corresponding module variants.
 
 
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