The ConnectCard for i.MX28 is a solution-on-module based on the Freescale i.MX28 processor family. It is an ideal embedded platform solution for connected applications in medical and healthcare, energy/solar, transportation and industrial/building automation.
Offering wired and wireless connectivity, the ConnectCard for i.MX28 offers easy design integration and unique peripheral/interface flexibility in an extremely compact and cost-effective form factor suitable for a wide range of different devices, including battery powered product designs.
ConnectCard modules feature the design, development and administrative advantages offered by the Device Cloud by Etherios™. This secure, highly-scalable platform seamlessly ties enterprise applications and remote devices together.
Device Manager empowers IT, network operations and customer support organizations to conquer the challenges of managing equipment in their device networks. Network managers can remotely configure, upgrade, monitor and troubleshoot remote devices, and create applications that improve productivity, speed and efficiency.
The ConnectCard i.MX28 module is equipped with a highly integrated 32-bit ARM core running at up to 454 MHz, on-chip power management, dual Ethernet and 802.11abgn networking options, Bluetooth 4.0 connectivity, dual FlexCAN options, GPIO, ADC, UART, USB high-speed, SPI, I2C, I2S, 1-Wire, PWM, and JTAG/ETM.
Digi JumpStart Kits for Digi Embedded Linux provide a complete turnkey embedded development solution allowing immediate product development with significantly accelerated time-to-market and reduced design risk.
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| Development Kits | North America: | International: | |
| ConnectCard for i.MX28 JumpStart Kit for Digi Embedded Linux, installation and setup support package View details |
CC-WMX28-LX |
CC-WMX28-LX |
Contact Us |
| Accessories | North America: | International: | |
| 7" WVGA LCD application kit for ConnectCore for i.MX51/i.MX53 and ConnectCard for i.MX28 family View details |
CC-ACC-LCDW-70 |
CC-ACC-LCDW-70 |
 Contact Us |
| Specifications | ConnectCard™ i.MX28 | ConnectCard™ Wi-i.MX28 |
| Processor | ||
| Processor Models | Freescale® i.MX280, i.MX287 | |
| Speed Grade | Up to 454 MHz | |
| Core Type | ARM926EJ-S | |
| Cache Memory | 16k I-Cache, 32k D-Cache | |
| Internal RAM | 128 KB SRAM | |
| Internal ROM (OCOTP) | 1,280 Bits | |
| Memory | ||
| Flash | Up to 2 GB NAND flash | |
| RAM | Up to 256 MB DDR2 | |
| Debug | ||
| JTAG | • | |
| ETM/ETB | • | |
| Power Management | ||
| Power Modes | Run, Standby, Deep Sleep | |
| Wake-up Events | RTC, GPIO, CAN, USB, Ethernet | |
| Auto Slow | • | |
| Li-Ion Battery Charger / Monitor | • | |
| Clock and Watchdog | ||
| Real-Time Clock | • | |
| Alarm | • | |
| Watchdog | • | |
| Security | ||
| Data Co-Processor (DCP) | 128-bit AES encryption SHA-1 / SHA256 hashing |
|
| Fusebox (OCOTP) | 1280 bits | |
| High-Assurance Boot (HAB4) | • | |
| Secure Boot | 128-bit AES decryption | |
| Peripherals | ||
| UART | Up to 4 channels with bit rates up to 3.25 MHz (AUART) Up to 1 channel with bit rate up to 115 kbps (DUART) |
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| CAN Bus | Up to 2 channels, CAN Bus 2.0B, bit rates up to 1 Mbps, 64 message buffers (0-8 bytes), low-power modes with wake-up |
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| SPI | Up to 2, master/slave modes | |
| I2S | Up to 1 | |
| I2C | Up to 2 channels, master/slave (7-/10-bit addressing), standard (100 kbps) and fast (400 kbps) mode |
|
| SD/SDIO/MMC | Up to 4 ports, 1-/4-/8-bit modes, up to 48 MHz | |
| USB 2.0 High-Speed | Up to 1 USB 2.0 High-Speed Host (with PHY) Up to 1 USB 2.0 OTG port (with PHY) |
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| 1-Wire (optional) | Maxim DS2482-100+ | |
| GPIO | Up to 32 (depending on module variant) | |
| PWM | Up to 4 | |
| Display | ||
| Resolution | 800x480 (WVGA) | |
| Refresh Rate | Up to 60 Hz | |
| Color Depth | 8/16/24 bpp | |
| Modes | RGB/DOTCK/SYSTEM | |
| Color Space Conversion | • | |
| Scaling | • | |
| Rotation | • | |
| Touch Screen | ||
| Touch Screen Controller | 4-/5-wire (LRADC) | |
| Ethernet | ||
| Physical Layer | 10/100Base-T | |
| Data Rates | 10/100 Mbps, auto-sensing | |
| Duplex Mode | Full or half duplex, auto-sensing | |
| IEEE 1588 | • (i.MX287 only) | |
| Power over Ethernet (802.3af) | ||
| Power over Ethernet | Development board ready for 802.3af PoE application kit (sold separately) | |
| Wi-Fi2 | ||
| Standard | N/A | 802.11a/b/g/n |
| Antenna Connectors | N/A | 2 x U.FL |
| Dual Diversity | N/A | • |
| Frequency Bands | N/A |
2.412 - 2.484 GHz 4.900 - 5.850 GHz |
| Data Rates | N/A |
802.11b: 1, 2, 5.5, 11 Mbps 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (HT40, MCS 0-7) |
| Modulation | N/A | DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM |
| Transmit Power (±2 dBm) | N/A |
802.11b: 10.5 dBm typical 802.11g/n: 11 dBm typical 802.11a/n: 13 dBm typical |
| Security | N/A | WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i |
| Wi-Fi Logo Certification | N/A | Ready |
| CCXv4 ASD | N/A | Ready |
| Bluetooth2 | ||
| Modes | N/A | Bluetooth 4.0 (Bluetooth 2.1 + EDR, Bluetooth 3.0 + HS 802.11 AMP, Bluetooth Low Energy) |
| Class | N/A | 1.5 |
| Profiles | N/A | GAP, SPP, HSP, HFP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP |
| Coexistence | N/A | • |
| Power Requirements (Use-Case Estimates) | ||
| Wi-Fi 2.4 GHz Transmit, CPU 454 MHz, 50%, UART active | 475mA @ 5V | |
| Wi-Fi 2.4 GHz Receive, CPU Idle (Auto Slow) |
325mA @ 5V | |
| Wi-Fi Standby (Sleep), CPU Standby (IRQ) |
45mA @ 5V | |
| Wi-Fi Standby (Host off), CPU Deep Sleep (RTC) |
112μA @ 5V | |
| Module Variants1 | ||
| Population Options | Processor models (i.MX280, i.MX281, i.MX283, i.MX285, i.MX286, i.MX287), flash, RAM, Single 10/100 Ethernet, dual 10/100 Ethernet w/1588, 802.11a/b/g/n Wi-Fi with Bluetooth 4.0, 1-Wire, LCD connector, CAN bus |
|
| Mechanical | ||
| Dimensions (L x W x H) w/o JTAG/LCD connector | 51 mm x 35 mm x 2.6 mm | 51 mm x 35 mm x 3 mm |
| Mating Connector for Module | Molex, P/N 67910-5700 Tyco, P/N 2041119-x |
|
| Retaining Clip for Module (Optional) | Molex, P/N 480995701 Tyco, P/N 1717832 |
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| JTAG/LCD Connector on Module (Optional) | FCI, P/N SFV31R-1STE1LF Tyco, P/N 3-1734839-1 |
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| Environmental | ||
| Operating Temperature | -40° C up to +85° C (-40° F to +185° F) Upper temperature ceilings may require active and/or passive thermal management such as lower clock speed, thermal pads, airflow, etc. |
|
| Storage Temperature | -50° C to +125° C (-58° F to +257° F) | |
| Relative Humidity | 5% to 90% (non-condensing) | |
| Altitude | 12,000 feet (3,658 meters) | |
| Approvals and Certifications | ||
| Emissions | FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17 |
|
| Immunity | EN 55024, EN 301 489-3 | |
| Safety | UL/UR, or equivalent | |
| Radio | US, Canada, EU, Japan, Australia/New Zealand | |
| Temperature | IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 | |
| Vibration/Shock | IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27 | |
| Design Test | HALT | |
