Digi ConnectCore 6+

NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless

  • Scalable Cortex-A9 multi-core performance
  • Cost-effective, reliable, low-profile surface-mount module form factor
  • Pre-certified 802.11a/b/g/n/ac and Bluetooth® 5
  • Smart Power Management Architecture with PMIC
  • Yocto Project Linux software platform support
  • Reliable design with IEC 60068 and HALT verification
  • Dedicated on-module security + authentication controller
  • Designed for long-term availability

The Digi ConnectCore® 6+ is an ultra-compact and highly integrated system-on-module solution based on the NXP i.MX6Plus Cortex-A9 processor family.

With processor speeds up to 1.2 GHz and fully pin-compatible dual-/quad-core variants, the ConnectCore 6+ offers a truly future-proof platform solution with scalable performance and pre-certified wireless 802.11a/b/g/n/ac and Bluetooth 5, including Bluetooth Low Energy, connectivity.

Its low-profile, surface-mount design maximizes integration flexibility and significantly reduces design risk in a highly cost effective, reliable form factor with optimized heat dissipation capabilities even in the most demanding quad-core system configurations.

Integrated cloud integration as part of the Digi Yocto Linux platform support offers secure remote management and web services capabilities through the scalable Digi Remote Manager®.

TrustFenceYocto ProjectBluetoothWi-Fi AllianceNXP Gold PartnerPowered by AWS

Build Secure Connected Embedded Devices Powered by Digi TrustFence


Device security is a critical design aspect for every connected device. The ConnectCore 6 combines a secure module platform with a complete embedded device security software framework. Build products today that provide you and your customers with a secure product platform now and in the future.

  • Managed device security software framework
  • U-Boot and Linux platform integration
  • Transparent and future-proof architecture
  • Zero implementation effort

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Digi Product Integration

Digi WDS engineers can customize Digi hardware components and software products to accelerate your time to market.
SPECIFICATIONS Digi ConnectCore® 6+
APPLICATION PROCESSOR NXP i.MX6Plus encompasses a quad-core Arm® Cortex®-A9 platform running up to 1.2 GHz with 1 MB of L2 cache, and optimized 64-bit DDR3 or 2-ch., 32-bit LPDDR2 support. Integrated FlexCAN, MLB busses, PCI Express®and SATA-2 provide excellent connectivity
MEMORY 8 GB flash, 2 GB DDR3
PMIC Dialog DA9063
GRAPHICS LVDS, MIPI display port, MIPI camera port and HDMI v1.4
SECURITY RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM,
3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC,
External address/data bus, Watchdog, Timers, JTAG
EXTERNAL BUS 26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes)
ETHERNET 1 Gigabit Ethernet
WI-FI 802.11a/b/g/n/ac
BLUETOOTH Bluetooth 5
OPERATING TEMPERATURE -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
STORAGE TEMPERATURE -50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY 5% to 90% (non-condensing)
RADIO APPROVALS US, Canada, EU, Australia/New Zealand
EMISSIONS / IMMUNITY / SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS- 210 Issue 5 Section 6.2.2(o), EN 300 328,
EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS LGA-400, 2 mm pitch, fully shielded (heat-spreading)

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