Digi ConnectCore System-on-Modules Single Board Computers Development kits

Digi ConnectCore 8X SOM based on NXP i.MX 8X

Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications

 
  • Industrial i.MX 8X quad/dual-core SOM and SBC platform family
  • Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability and design freedom
  • Power management with both hardware and software support for low-power designs
  • Multi-display and camera capabilities with hardware acceleration
  • Pre-certified dual-band 802.11a/b/g/n/ac 2x2 and Bluetooth® 5 connectivity
  • Seamless cellular modem and Digi XBee® 3 integration
  • Cloud and edge-compute services integration
  • Built-in device security with Digi TrustFence®
  • Remote management with Digi ConnectCore® Cloud Services
  • Digi Embedded Yocto  Linux® and Android support

Digi ConnectCore® 8X delivers a secure and cost-effective connected system-on-module platform that measures in at just 40 mm x 45 mm.

The Digi SMTplus® surface mount form factor allows you to choose simplified design integration leveraging proven and easy-to-use edge-castellated SMT technology, or a versatile LGA option for ultimate design flexibility with access to virtually all interfaces.

Built on the NXP® i.MX 8X application processor

The module is the intelligent communication engine for today’s secure connected devices. Digi ConnectCore 8X can help jump-start the development of streaming video/audio devices, voice control and general human-machine interface solutions.

With a multitude of high performance interconnecting options, including 1x USB 3.0 port, dual Gigabit Ethernet, PCIe 3.0, and pre-certified dual-band 2x2 MU-MIMO WLAN, ConnectCore 8X is ideal for developing a wide range of embedded and IoT applications.

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Digi Product Integration

Digi WDS engineers can customize Digi hardware components and software products to accelerate your time to market.

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Kits
SKU: CC-WMX8-KIT Digi ConnectCore 8X SBC Pro Development Kit CC-WMX8-KIT How to Buy
Dual-core Modules
SKU: CC-MX-JQ7D-ZN Digi ConnectCore® 8X SOM DualXZ 1.2 GHz, 8 GB eMMC, 1 GB LPDDR4 CC-MX-JQ7D-ZN How to Buy
Quad-core Modules
SKU: CC-MX-JM7D-ZN Digi ConnectCore® 8X SOM QuadXPlus 1.2 GHz, 8 GB eMMC, 1 GB LPDDR4 CC-MX-JM7D-ZN How to Buy
SKU: CC-MX-JM8D-ZN Digi ConnectCore® 8X SOM QuadXPlus 1.2 GHz, 8 GB eMMC, 2 GB LPDDR4 CC-MX-JM8D-ZN How to Buy
SKU: CC-WMX-JM7D-NN Digi ConnectCore® 8X SOM QuadXPlus 1.2 GHz, 8 GB eMMC, 1 GB LPDDR4, 802.11a/b/g/n/ac 2x2, Bluetooth® 5 CC-WMX-JM7D-NN How to Buy
SKU: CC-WMX-JM8E-NN Digi ConnectCore® 8X SOM QuadXPlus 1.2 GHz, 16 GB eMMC, 2 GB LPDDR4, 802.11a/b/g/n/ac, 2x2, Bluetooth® 5 CC-WMX-JM8E-NN How to Buy
SBCs
SKU: CC-SBP-WMX-JM8E Digi ConnectCore® 8X SBC Pro CC-SBP-WMX-JM8E How to Buy
SMARC Adapter
Digi SMARC Adapter
SMARC® Adapter SOM and SBC reference designs provide maximum flexibility and scalability for Digi ConnectCore® SOMs
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Accessories
SKU: CC-ACC-LCDH-10 LCD Application Kit, including 10 in WXGA (high resolution) LCD panel CC-ACC-LCDH-10 How to Buy
Services and Support
Cloud Services
Digi ConnectCore® Cloud Services enable OEMs in a wide range of industries to create connected devices with remote-dashboard, -service and -application capabilities using Digi ConnectCore system-on-modules (SOMs).
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Security Services
Maintaining the security for connected devices after product release is challenging. Digi ConnectCore® Security Services enable customers to keep products secure.
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Support Services
Get the help you need to deploy, manage, connect, customize and enhance your Digi solution
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Wireless Design Services
Digi wireless design services help companies solve business problems by embedding wireless technologies to create innovative M2M products
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SPECIFICATIONS Digi ConnectCore® 8X Digi ConnectCore® 8X Dual
APPLICATION PROCESSOR NXP® i.MX8QuadXPlus
  • 4x Cortex® — A35 cores at 1.2 GHz
  • 1x Cortex — M4F at 266 MHz core for real-time processing
  • 1x Tensilica® Hi-Fi 4 DSP
NXP® i.MX8DualXZ
  • 2x Cortex® — A35 cores at 1.2 GHz

 
MEMORY Up to 64 GB eMMC, up to 4 GB of LPDDR4
PMIC NXP PF8100
GRAPHICS Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders
SECURITY Digi TrustFence®, TRNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
PERIPHERALS/ INTERFACES** 1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4);
8x I2C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support),
4x SPI, 1x ESAI, 4x SAI/I2S/SSI/AC97, S/PDIF Tx/Rx, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY,
4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,
24-bit RGB, RTC, Watchdog, Timers, JTAG
1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4);
8x I2C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support),
4x SPI, 1x ESAI, 4x SAI/I2S/SSI/AC97, S/PDIF Tx/Rx, 3x FlexCAN, MLB150 + DTCP, USB 2.0 OTG with PHY,
4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,
24-bit RGB, RTC, Watchdog, Timers, JTAG
ETHERNET 2x 10/100/1000M Ethernet + AVB
WI-FI 802.11a/b/g/n/ac: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7
802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical ±2 dBm) HT40, MCS 0-9
Note: all data rates provided above are for 1 spatial stream. For 2x spatial steams, double the data rate.
Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2-enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct
Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready
BLUETOOTH Bluetooth® 5
ON-MODULE MICROCONTROLLER ASSIST Digi Microcontroller Assist™
  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes at <3 µA
OPERATING TEMPERATURE Industrial: −40 °C to 85 °C (−40 °F to 185 °F) (depending on use case and enclosure/system design)
STORAGE TEMPERATURE −50 °C to 125 °C (−58 °F to 257 °F)
RELATIVE HUMIDITY 5% to 90% (non-condensing)
RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS/ IMMUNITY/ SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS 118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 5.4 mm (1.6 in x 1.8 in x 0.21 in)
PRODUCT WARRANTY 3-year
*PCIe is only supported on wired variants
**Each single PHY can either be a 1 x 4 lane MIPI-DSI or a 1 x 1 channel LVDS interface for a total of 2 display interfaces. In combination, the two PHYs can be configured to be a single 2-channel LVDS interface.
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