ConnectCore® 6+

NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless

Scalable Cortex-A9 multi-core performance
Independent Cortex-M0+/Cortex-M4 Microcontroller Assist™ subsystem
Cost-effective, reliable, low-profile surface-mount module form factor
Pre-certified 802.11a/b/g/n/ac and Bluetooth 4.2
Smart Power Management Architecture with PMIC
Android and Yocto Project Linux software platform support
Reliable design with IEC 60068 and HALT verification
Dedicated on-module security + authentication controller
Designed for long-term availability

Overview Part Numbers & Accessories Specifications Resources Product Support

The ConnectCore 6+ is an ultra-compact and highly integrated system-on-module solution based on the NXP i.MX6Plus Cortex-A9 processor family.

With processor speeds up to 1.2 GHz and fully pin-compatible dual-/quad-core variants, the ConnectCore 6+ offers a truly future-proof platform solution with scalable performance and pre-certified wireless 802.11a/b/g/n/ac and Bluetooth 4.2, including Bluetooth Low Energy, connectivity.

Its low-profile, surface-mount design maximizes integration flexibility and significantly reduces design risk in a highly cost effective, reliable form factor with optimized heat dissipation capabilities even in the most demanding quad-core system configurations.

Integrated cloud integration as part of the Digi Yocto Linux and Android software platform support offers secure remote management and web services capabilities through the scalable Digi Remote Manager®.

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Build Secure Connected Embedded Devices Powered By Digi TRUSTFENCE®

Device security is a critical design aspect for every connected device. The ConnectCore 6 combines a secure module platform with a complete embedded device security software framework. Build products today that provide you and your customers with a secure product platform now and in the future.

Managed device security software framework
U-Boot and Linux platform integration
Transparent and future-proof architecture
Zero implementation effort

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MODULE
	ConnectCore 6+ module, i.MX6QuadPlus, 1.0 GHz, -40 to 85°C, 8 GB flash, 2 GB DDR3, 802.11a/b/g/n/ac, Bluetooth 4.2, Ethernet	CC-WMX-KK8D-TN	HOW TO BUY Contact Us

KIT
	ConnectCore 6+ professional development kit	CC-WMX6P-KIT	HOW TO BUY Contact Us

SPECIFICATIONS	ConnectCore® 6+
APPLICATION PROCESSOR	NXP i.MX6Plus encompasses a quad-core Arm® Cortex®-A9 platform running up to 1.2 GHz with 1 MB of L2 cache, and optimized 64-bit DDR3 or 2-ch., 32-bit LPDDR2 support. Integrated FlexCAN, MLB busses, PCI Express®and SATA-2 provide excellent connectivity
MEMORY	8 GB flash, 2 GB DDR3
PMIC	Dialog DA9063
GRAPHICS	LVDS, MIPI display port, MIPI camera port and HDMI v1.4
SECURITY	RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
PERIPHERALS/INTERFACES	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, ESAI, I2S/SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG
EXTERNAL BUS	26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes)
ETHERNET	1 Gigabit Ethernet
WI-FI	802.11a/b/g/n/ac
BLUETOOTH	Bluetooth 4.2
ON-MODULE MICROCONTROLLER ASSIST	Microcontroller Assist (MKL14Z32VFT4)
OPERATING TEMPERATURE	-40° C to +85° C
STORAGE TEMPERATURE	-50° C to +125° C (-58° F to +257° F)
RELATIVE HUMIDITY	5% to 90% (non-condensing)
ALTITUDE	12,000 feet (3,658 meters)
RADIO APPROVALS	US, Canada, EU, Australia/New Zealand
EMISSIONS / IMMUNITY / SAFETY	FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS- 210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
DESIGN VERIFICATION	Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS	LGA-400, 2 mm pitch, fully shielded (heat-spreading)