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Digi ConnectCore® 8X

Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications

  • Industrial i.MX 8X quad/dual-core SOM and SBC platform family
  • Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability and design freedom
  • Power management – both hardware and software support for low-power designs
  • Multi-display and camera capabilities with hardware acceleration
  • Pre-certified dual-band 802.11a/b/g/n/ac 2x2 and Bluetooth® 5 connectivity
  • Seamless cellular modem and Digi XBee® 3 integration
  • Cloud and edge-compute services integration
  • Built-in device security with Digi TrustFence®
  • Yocto Project Linux and Android support
How to Buy
Digi ConnectCore® 8X delivers a secure and cost-effective connected System-on-Module platform that measures in at just 40 mm x 45 mm. The Digi SMTplus® surface mount form factor allows you to choose simplified design integration leveraging proven and easy-to-use edge-castellated SMT technology, or a versatile LGA option for ultimate design flexibility with access to virtually all interfaces.

Built on the NXP i.MX 8X application processor, the module is the intelligent communication engine for today’s secure connected devices. ConnectCore 8X can help jump-start the development of streaming video/audio devices, voice control and general human-machine interface solutions. With a multitude of high performance interconnecting options, including 1x USB 3.0 port, dual Gigabit Ethernet, PCIe 3.0, and pre-certified dual-band 2x2 MU-MIMO WLAN, ConnectCore 8X is ideal for developing a wide range of embedded and IoT applications.


  • 4x Cortex-A35 cores @ 1.0 GHz
  • 1x Cortex-M4F @266MHz core for real-time processing
  • 1x Tensiilica® Hi-Fi 4 DSP
MEMORY Up to 64 GB eMMC, up to 4GB of LPDDR4
GRAPHICS Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders
SECURITY Digi TrustFence®, TRNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
PERIPHERALS/ INTERFACES 1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4), S/PDIF Tx/Rx,
8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support),
4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY,
4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane), 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,
24-bit RGB, RTC, Watchdog, Timers, JTAG
ETHERNET 2x 10/100/1000M Ethernet + AVB
WI-FI 802.11a/b/g/n/ac: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7
802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical ±2 dBm) HT40, MCS 0-9
Note: all data rates provided above are for 1 spatial stream. For 2x spatial steams, double the data rate.
Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2-enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct
Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready
BLUETOOTH Bluetooth 5
  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes @ <3µA
OPERATING TEMPERATURE Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design)
Commercial: 0° C to 70° C (32° F to 158° F)
STORAGE TEMPERATURE -50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY 5% to 90% (non-condensing)
RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS/ IMMUNITY/ SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS 118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 3.5 mm


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