Digi ConnectCore 95 — i.MX 959, hexa A55, NPU/ISP, 8 GB LPDDR5, 32 GB eMMC, Wi-Fi 6E 802.11ax, Bluetooth 5.4, −40 °C to 85 °C (−40 °F to 185 °F), Cloud Services, SMTplus

Digi ConnectCore® 95 SMT System-On-Module Solution

i.MX 959, hexa A55, NPU/ISP, 8 GB LPDDR5, 32 GB eMMC, Wi-Fi 6E 802.11ax, Bluetooth® 5.4, −40 °C to 85 °C (−40 °F to 185 °F), Cloud Services, SMTplus®

High-performance wireless all-in-one SOM solution based on NXP® i.MX 95 with integrated cloud, security, AI/ML services and scalability for industrial IoT applications

Digi ConnectCore 95 redefines the system-on-module (SOM), delivering integrated intelligence, connectivity and security — built in from the start. Based on the NXP i.MX 95 application processor, the high-performance wireless all-in-one SOM platform provides a complete solution to simplify the development and management of intelligent connected devices.

The Digi SMTplus surface-mount module is optimized for the i.MX 95 processor and delivers maximum design flexibility and robustness for portable and demanding industrial applications.

Digi ConnectCore SOM solutions provide built-in security with Digi TrustFence®, a fully integrated device-security framework simplifying the process of securing connected devices. Essential Digi ConnectCore Cloud Services are included with every SOM. Premium Digi ConnectCore Cloud Services (with flexible pay-per-use option), Digi ConnectCore Security Services and Expert Support extend capabilities for additional development, deployment, maintenance and long-term lifecycle support. 

• Application processor:
  • NXP i.MX 959
    • 6x Cortex®-A55 core, up to 1.8 GHz (64-bit)
• Memory: 
  • 32 GB flash (eMMC)
  • 8 GB LPDDR5 (32-bit, ECC)
• Artificial intelligence:
  • AI/ML NXP eIQ® Neutron NPU N3-1024S, 2 TOPs (hardware), up to 8 TOPs sparse model performance
• PMIC:
  • ​NXP PF09 + PF53 and Energy Flex Multi-Domain architecture for maximum power efficiency
• Image signal processor:
  • ​NXP ISP (12 MP at 45 fps, 8 MP at 30 fps) with RGB-IR support (4x4 array pattern), YUV 420, YUV 422, YUV 444, RGB 888
• Ethernet:
  • 1x 10 GbE + 2x Gb Ethernet (All w/TSN); AVB & IEEE 1588 for sync; and EEE
• Wi-Fi:
  • ​Wi-Fi 6E 802.11ax tri-band, 80 MHz channel bandwidth, high throughput, 1x1 wireless
• Bluetooth:
  • ​Bluetooth 5
• Operating temperature: 
  • Industrial-rated −40 °C to 85 °C (−40 °F to 185 °F), depending on use case and enclosure/system design
• Storage temperature: 
  • −50 °C to 125 °C (−58 °F to 257 °F)
• Product warranty: 
  • 3-year