Digi announced the new Digi XBee® 3 Series of smart modules in 2018. Digi XBee 3 builds on industry-leading embedded technology, offers design freedom with easy-to-add functionality and flexible wireless connectivity. The new Micro form factor allows customers to shrink their devices with new low-power requirements making it ideal for battery-powered applications, and both portable and remote devices. It brings a new era of flexibility to mesh networking and new LTE cellular technologies enabling a higher level of abstraction without the lead times and complexities of chip-down designs. A few advanced features include:
Today, developers of Internet of Things (IoT) devices require more options for connectivity as well as increased computing power for processing data at the edge of the network. The Digi XBee 3 series includes Zigbee 3.0 for mesh networking and Digi XBee 3 Cellular with the latest LTE technologies like LTE-M and NB-IoT. All available in the compact and pin-compatible form factor.
One socket allows you to connect to IoT networks around the globe. With the authentic Digi XBee footprint, and end-device certifications, allowing you to future-proof your design and know that Digi has you covered for new wireless technologies as they emerge. From multiple global protocols and expanded programmability to the Digi TrustFence® security framework and future-proof form factor, Digi XBee 3 gives you even more options for connectivity.