Digi ConnectCore System-on-Modules Single Board Computers Development kits

Digi ConnectCore 8M Nano SOM based on NXP i.MX 8M Nano

Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications

 
  • Industrial i.MX 8M Nano single/quad-core system-on-module
  • Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability and design freedom
  • Power management with both hardware and software support for low-power designs
  • Display and camera capabilities with hardware acceleration
  • Pre-certified dual-band 802.11a/b/g/n/ac 1x1 and Bluetooth® 5 connectivity
  • Seamless cellular modem and Digi XBee® integration
  • Cloud and edge-compute services integration
  • Built-in device security, identity and privacy with Digi TrustFence®
  • Remote management with Digi ConnectCore® Cloud Services
  • Digi Embedded Yocto  Linux® support

Digi ConnectCore® 8M Nano, based on the NXP® i.MX 8M Nano application processor, is an integrated system-on-module (SOM) platform.

The Nano is designed for a wide range of industrial, medical, agricultural and transportation applications, including Internet of Things (IoT), human-machine interface (HMI), equipment monitoring, audio/voice, edge computing and machine learning (e.g. anomaly detection).

Digi ConnectCore 8M Nano features up to 4x power-efficient Arm® Cortex®-A53 cores and 1x Cortex-M7 core, which allow it to minimize power consumption while maintaining a high standard of performance.

This SOM is designed for industrial reliability and the 10+ year product lifecycles of embedded devices. It helps OEMs lower their R&D and development costs and realize a lower total cost of ownership by leveraging pre-certified wireless connectivity, remote management, cloud integration and a complete Linux® software platform based on Yocto Project®.

In addition, built in Digi TrustFence® enables OEM developers to integrate critical security and data privacy capabilities into their products.

TrustFenceYocto ProjectBluetoothWi-Fi AllianceNXP Gold PartnerPowered by AWS

Digi ConnectCore Voice Control

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Digi ConnectCore Voice Control

Easy-to-integrate touch-free voice control at the edge for hands-free device control in any interactive application

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Digi ConnectCore 8M Nano

Digi ConnectCore 8M Nano

The most complete i.MX 8M Nano development kit is available

The Digi ConnectCore 8M Nano is an embedded system on module (SOM) that supports rapid product development with complete open-source and scalable embedded software development tools, pre-certified wireless connectivity, cloud integration and built-in security. Launch your next product design with Digi ConnectCore 8M Nano.

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Digi WDS engineers can customize Digi hardware components and software products to accelerate your time to market.

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Kits
SKU: CC-WMX8MN-KIT Digi ConnectCore 8M Nano Development Kit CC-WMX8MN-KIT How to Buy
Modules
SKU: CC-WMX-FS7D-NN Digi ConnectCore 8M Nano, Quad Core, 8 GB eMMC, 1 GB LPDDR4, wireless CC-WMX-FS7D-NN How to Buy
SKU: CC-WMX-FR6D-NN Digi ConnectCore 8M Nano, SoloLite Core, 8 GB eMMC, 512 MB LPDDR4, wireless CC-WMX-FR6D-NN How to Buy
SKU: CC-MX-FS7D-ZN Digi ConnectCore 8M Nano, Quad Core, 8 GB eMMC, 1 GB LPDDR4, Ethernet CC-MX-FS7D-ZN How to Buy
SKU: CC-MX-FR6D-ZN Digi ConnectCore 8M Nano, SoloLite Core, 8 GB eMMC, 512 MB LPDDR4, Ethernet CC-MX-FR6D-ZN How to Buy
Accessories
SKU: CC-ACC-LCDH-10 LCD Application Kit, including 10 in WXGA (high resolution) LCD panel CC-ACC-LCDH-10 How to Buy
Services and Support
Digi ConnectCore Cloud Services
Digi ConnectCore® Cloud Services enable OEMs in a wide range of industries to create connected devices with remote-dashboard, -service and -application capabilities using Digi ConnectCore system-on-modules (SOMs).
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Digi ConnectCore Security Services
Maintaining the security for connected devices after product release is challenging. Digi ConnectCore® Security Services enable customers to keep products secure.
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Support Services
Get the help you need to deploy, manage, connect, customize and enhance your Digi solution
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Wireless Design Services
Digi wireless design services help companies solve business problems by embedding wireless technologies to create innovative M2M products
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SPECIFICATIONS Digi ConnectCore® 8M Nano
APPLICATION PROCESSOR NXP® i.MX8 Nano
  • Up to 4x Cortex®-A53 cores at 1.4 GHz
  • 1x Cortex-M7 core at 600 MHz core for real-time processing
MEMORY Up to 8 GB eMMC, up to 1 GB of LPDDR4 (16-bit)
PMIC NXP PCA9450A
GRAPHICS Graphic Processing Unit:
  • GC7000UL with OpenCL and Vulkan support
  • 2 shader
  • 123 million triangles / sec
  • 0.8 giga pixel / sec
  • 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit
  • Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL
  • Shader clock frequency of 500 MHz
LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI; MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface)
SECURITY Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
PERIPHERALS/ INTERFACES 1x USB 2.0 OTG controllers with integrated PHY interfaces
3x Ultra Secure Digital Host Controller (uSDHC) interfaces
4x Universal Asynchronous Receiver / Transmitter (UART) modules
4x I2C modules
3x SPI modules
1x Quad SPI
10x PWM channels
1x 16-bit ADC module with accurate internal voltage reference, up to 20 channels
5x Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, codec/DSP and DSD interfaces
1x S/PDIF input and output, including a raw capture input mode
8-channel Pulse Density Modulation (PDM) input
Up to 112 GPIOs
ETHERNET 1x 10/100/1000M Ethernet + AVB
WI-FI 1x1 802.11a/b/g/n/ac dual-band wireless
BLUETOOTH Bluetooth® 5
ON-MODULE MICROCONTROLLER ASSIST Digi Microcontroller Assist™
  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes at <3 µA
OPERATING TEMPERATURE Industrial: -40 °C to 85 °C (-40 °F to 185 °F); depending on use case and enclosure/system design
STORAGE TEMPERATURE -50 °C to 125 °C (-58 °F to 257 °F)
RELATIVE HUMIDITY 5% to 90% (non-condensing)
RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS/ IMMUNITY/ SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548; FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS 118 castellated vias, LGA-474, 1.27 mm pitch, 
40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
PRODUCT WARRANTY 3-year
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