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Digi ConnectCore® 8M Nano

Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications

 
  • Industrial i.MX 8M Nano quad/dual-core System-on-Module
  • Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability and design freedom
  • Power management with both hardware and software support for low-power designs
  • Multi-display and camera capabilities with hardware acceleration
  • Pre-certified dual-band 802.11a/b/g/n/ac 1x1 and Bluetooth® 5 connectivity
  • Seamless cellular modem and Digi XBee® integration
  • Cloud and edge-compute services integration
  • Built-in device security, identity and privacy with Digi TrustFence®
  • Remote monitoring and management with Digi Remote Manager®
  • Yocto Project Linux support
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Digi ConnectCore® 8M Nano, based on the NXP® i.MX 8M Nano application processor, is an integrated system-on-module (SOM) platform. The Nano is designed for a wide range of industrial, medical, agricultural and transportation applications, including Internet of Things (IoT), human-machine interface (HMI), equipment monitoring, audio/voice, edge computing and machine learning (e.g. anomaly detection).

Digi ConnectCore 8M Nano features up to 4x power-efficient Arm® Cortex®-A53 cores and 1x Cortex-M7 core, which allow it to minimize power consumption while maintaining a high standard of performance. This SOM is designed for industrial reliability and the 10+ year product lifecycles of embedded devices. It helps OEMs lower their R&D and development costs and realize a lower total cost of ownership by leveraging pre-certified wireless connectivity, remote management, cloud integration and a complete Linux software platform based on Yocto Project®. In addition, built in Digi TrustFence® enables OEM developers to integrate critical security and data privacy capabilities into their products.
Digi ConnectCore 8M Nano

Digi ConnectCore 8M Nano

The most complete i.MX 8M Nano development kit is available

The Digi ConnectCore 8M Nano supports rapid product development with complete open-source and scalable embedded software development tools, pre-certified wireless connectivity, cloud integration and built-in security. Launch your next product design with Digi ConnectCore 8M Nano.

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Embedded Computing: Designing for Ease of Manufacturing and Low Cost-of-Ownership The embedded system-on-module (SOM) market has grown, offering diverse options for applications ranging from retail displays to... READ BLOG Digi ConnectCore 8M Nano development kit datasheet The Digi ConnectCore 8M Nano development kit is a cohesive and cost-effective System-on-Module (SOM) platform built on the NXP® i.MX 8M Nano applications processor DOWNLOAD PDF Machine Learning and Machine Vision Work Better with Real Time Edge Processing Among the most promising complementary technologies today are machine learning (ML) and machine vision (MV). Machine learning... READ BLOG Digi ConnectCore 8M Nano datasheet Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications. DOWNLOAD PDF Digi International to Showcase Latest IoT Connectivity, Edge Computing Solutions and Customer Applications at Embedded World 2020 Digi Presents ConnectCore 8M Nano SOM Development Kit as well as its Expanding Suite of Digi XBee Modules, Software and Tools. READ PRESS RELEASE Digi ConnectCore 8M Nano: Developer Resources, Security, Scalability Digi International recently announced availability of the Digi ConnectCore 8M Nano Development Kit. The Digi ConnectCore® 8M... READ BLOG Digi Expands its SOM Portfolio with the Introduction of Digi ConnectCore 8M Nano Highly integrated SOM platform based on NXP® i.MX 8M Nano lowers cost, reduces risk and accelerates time-to-market for... READ PRESS RELEASE Digi ConnectCore embedded feature product comparison guide - SOMs and SBCs Digi ConnectCore embedded feature product comparison guide - SOMs and SBCs DOWNLOAD PDF
 
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SPECIFICATIONS Digi ConnectCore® 8M Nano
APPLICATION PROCESSOR NXP i.MX8 Nano
  • 4x Cortex-A53 cores @ 1.4 GHz
  • 1x Cortex-M7 core @ 750 MHz core for real-time processing
MEMORY Up to 8 GB eMMC, up to 1 GB of LPDDR4 (16-bit)
PMIC Rohm BD71850MWV
GRAPHICS Graphic Processing Unit:
  • GC7000UL with OpenCL and Vulkan support
  • 2 shader
  • 123 million triangles / sec
  • 0.8 giga pixel / sec
  • 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit
  • Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL
  • Shader clock frequency of 500 MHz
LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI; 4-lane MIPI DSI interface
SECURITY Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
PERIPHERALS/ INTERFACES 1x USB 2.0 OTG controllers with integrated PHY interfaces
3x Ultra Secure Digital Host Controller (uSDHC) interfaces
1x Gigabit Ethernet controller
4x Universal Asynchronous Receiver / Transmitter (UART) modules
4x I2C modules
3x SPI modules
ETHERNET 1x 10/100/1000M Ethernet + AVB
WI-FI 1x1 802.11a/b/g/n/ac dual-band wireless
BLUETOOTH Bluetooth® 5
ON-MODULE MICROCONTROLLER ASSIST Digi Microcontroller Assist™
  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes @ <3µA
OPERATING TEMPERATURE Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
STORAGE TEMPERATURE -50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY 5% to 90% (non-condensing)
RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS/ IMMUNITY/ SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548; FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS 118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading)
40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
PRODUCT WARRANTY 3-year
Embedded Computing: Designing for Ease of Manufacturing and Low Cost-of-Ownership The embedded system-on-module (SOM) market has grown, offering diverse options for applications ranging from retail displays to... READ BLOG Digi ConnectCore 8M Nano development kit datasheet The Digi ConnectCore 8M Nano development kit is a cohesive and cost-effective System-on-Module (SOM) platform built on the NXP® i.MX 8M Nano applications processor DOWNLOAD PDF Machine Learning and Machine Vision Work Better with Real Time Edge Processing Among the most promising complementary technologies today are machine learning (ML) and machine vision (MV). Machine learning... READ BLOG Digi ConnectCore 8M Nano datasheet Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications. DOWNLOAD PDF Digi International to Showcase Latest IoT Connectivity, Edge Computing Solutions and Customer Applications at Embedded World 2020 Digi Presents ConnectCore 8M Nano SOM Development Kit as well as its Expanding Suite of Digi XBee Modules, Software and Tools. READ PRESS RELEASE Digi ConnectCore 8M Nano: Developer Resources, Security, Scalability Digi International recently announced availability of the Digi ConnectCore 8M Nano Development Kit. The Digi ConnectCore® 8M... READ BLOG Digi Expands its SOM Portfolio with the Introduction of Digi ConnectCore 8M Nano Highly integrated SOM platform based on NXP® i.MX 8M Nano lowers cost, reduces risk and accelerates time-to-market for... READ PRESS RELEASE Digi ConnectCore embedded feature product comparison guide - SOMs and SBCs Digi ConnectCore embedded feature product comparison guide - SOMs and SBCs DOWNLOAD PDF

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