Digi XBee 3 Global LTE Cat 1, 3G/2G, GNSS, Verizon SIM

Digi XBee 3 Global LTE Cat 1, 3G/2G, GNSS, Verizon SIM

  • Hardware
    • Cellular Chipset: Thales PLS63-W
    • Form factor (connector footprint): Digi XBee® 20-pin through-hole
    • Antenna options: 2 U.FL: cellular diversity, 1 U.FL: GNSS; embedded Bluetooth® antenna
    • Dimensions: 30.48 mm x 43.18 mm (1.2 in x 1.7 in)
    • Operating temperature: −40 ºC to 80 ºC (−40 ºF to 176 ºF)
    • SIM size: 4FF Nano
  • Interface and I/O
    • Data interface: UART, SPI, USB
    • Operating modes: Transparent and API over serial, PPP over USB
    • Security: Digi TrustFence® security with secure boot and protected JTAG
    • Configuration tools: Digi XBee Studio® (local), Digi Remote Manager® (OTA)
    • Embedded programmability: MicroPython with 8 MB flash / 64 kB RAM
    • I/O: 4 ADC lines (10-bit), 13 digital I/O, I2C
    • Bluetooth: Bluetooth Low Energy (BLE)
  • Cellular characteristics
    • Transmit power (4G LTE/3G/2G): 23 dBm / 23.5 dBm / 30-33 dBm
    • Receive sensitivity (4G LTE/3G/2G): 103 dBm / 110 dBm / 108 dBm
    • Supported bands: B1, B2, B3, B4, B5, B7, B8, B12, B13, B18, B19, B20, B25, B26, B28, B38, B40, B41, B66
    • Downlink / uplink speeds: 10 Mbps downlink, 5 Mbps uplink (USB); 921 kbps downlink and uplink (UART)
    • Duplex mode: Full-duplex
  • Power requirements (at 3.3 VDC input power)
    • Supply voltage: 2.8 to 5.5 V
    • Peak transmit current: 1050 mA with Bluetooth disabled; 1090 mA with Bluetooth enabled
    • Avg transmit current: 890 mA
    • Avg receive current: 320 mA
  • Regulatory and carrier approvals
    • FCC (USA): MCQ-XB3C2 and QIPPLS63-W
    • ISED (Canada): 1846A-XB3C2 and 7830A-PLS63W
    • CE / RED (Europe): Complete
    • RCM (Australia / New Zealand): Pending
    • ANATEL (Brazil): Complete
    • UKCA (United Kingdom): Complete
    • PTCRB, AT&T and Verizon: Complete
  • Warranty
    • 1-year
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