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Digi ConnectCore® i.MX53 / Wi-i.MX53

NXP/Freescale i.MX53 Cortex A8 SoM

 
  • High-performance 32-bit System-on-Module
  • Long-term product availability solution
  • Single and dual 10/100 Mbit Ethernet networking
  • Pre-certified 802.11a/b/g/n Wi-Fi interface
  • High-performance 2D/3D Graphics Processing Unit
  • Hardware video processing with 1080p decoding
  • Low-emission design with FCC Class B compliance
  • Zigbee, cellular and satellite connectivity options
  • Industrial operating temperature support
  • Support for Embedded Linux®, Microsoft Windows® Compact 7, Android™, and Yocto Project® Linux
How to Buy

The network-enabled Digi ConnectCore® for i.MX53 family is a highly integrated and future-proof system-on-module (SoM) solution based on the NXP®/Freescale® i.MX53 application processor. It offers a high performance 1 GHz ARM® Cortex®-A8 core, wired and wireless connectivity, powerful 1080p/720p video encoding/decoding capabilities, and a complete peripheral set.

The Digi ConnectCore for i.MX53 family builds on the successful ConnectCore for i.MX51 modules by providing a form factor compatible option with significantly improved processing, memory, video and connectivity capabilities. It is a scalable and energy-efficient module family that is ideal for medical devices, security/surveillance equipment, industrial applications, kiosk systems and digital signage integration.

The ConnectCore for i.MX53 modules combine industry-leading performance, low power consumption and easy design integration with key features like integrated power management IC, on-chip multimedia support, including multi-format 1080p video hardware decoding, 2D/3D graphics acceleration, dual display/camera interface, hardware encryption engine, 802.11abgn Wi-Fi interface (150 Mbps), Bluetooth® 4.0 with HDP support, dual 10/100 Ethernet option, dual-CAN bus, SATA II storage interface and a comprehensive set of additional peripherals.

Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by Digi Remote Manager®. This robust cloud platform makes it easy to configure and manage deployments and integrate devices with virtually any application. Device manufacturers can build secure, highly scalable and cost-effective solutions that seamlessly tie assets to applications, regardless of location.

Complete and cost-efficient Digi JumpStart Kits® for Digi Embedded Linux®, Android™ and Microsoft Windows® Embedded Compact 7 allow immediate and professional embedded product development with dramatically reduced design risk and time-to-market. Additional support for Yocto Project® Embedded Linux is also available for download.

NASA installed Digi International's ConnectCore Wi-i.MX53 wireless module to Wi-Fi enable the Robonaut.

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DIGI PRODUCT INTEGRATION
Digi WDS engineers can customize Digi hardware components and software products to accelerate your time to market
Specifications Digi ConnectCore® i.MX53 Digi ConnectCore® Wi-i.MX53
Processor
Processor Model NXP®/Freescale® i.MX535/i.MX537
Speed Grades 1000/800 MHz
Core Type ARM® Cortex®-A8
Cache Memory 32k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified)
Internal RAM 128 KB (secure/non-secure)
Vector Floating Point
NEON Media Acceleration
Memory
Flash Up to 8 GB NAND flash
RAM Up to 2 GB DDR2
Debug
Secure JTAG
ETM/ETB
Power Management
Power Modes Run, Wait, Stop, Low-power screen refresh
Wake-up Events GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach
Dynamic Voltage and Frequency Scaling
Backlight Drivers 3
Battery Management
Real Time Clock
Battery Backup (External)
Security
Hardware encryption/decryption AES, DES/3DES, RC4, C2
RSA, ECC
MD5, SHA-1/224/256
Random Number Generator
Run Time Integrity Checker
Secure RAM (internal)
Fuse Box (e-Fuses) 64 Bits (application-specific use)
Physical Tamper Detectors
Timers
General Purpose Timer 32-bit up-counter with clock source selection
2 input capture channels
3 output compare channels, forced compare
Enhanced Periodic Interrupt Timer 32-bit down-counter with clock source selection
Set-and-forget/free-running modes
Precision interrupt generation
Watchdog
Thermal Management
Temperature Monitor On-chip sensor, precision 0 to 135°C ±5°C
Software support for thermal-aware Dyamic Frequency and Voltage Scaling (DFVS)
Connectivity
UART Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support
IrDA Infrared Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps)
CAN Up to 2 channels, up to 1 Mbps each, CAN 2.0b (available on i.MX537 variant)
CSPI Master and slave mode
Bit rate up to 25 Mbps (master)
eCSPI Up to 2 eCSPI channels, master and slave mode, bit rates up to 52 Mbps
I2C Up to 2 eCSPI channels, master and slave mode
Bit rates up to 66.5 Mbps (master)
SD/SDIO/MMC/eMMC Up to 4 ports, 1-/4-/8-bit modes
MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode)
eMMC 4.4: Ultra high speed, up to 832 Mbps
I2C Up to 3 channels, master/slave (7-/10-bit addressing)
All: Standard (100 kbps) and fast (400 kbps) mode
P-ATA Up to 66 MB/s data rate
PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5)
SATA SATA II, up to 1.5 Gbps
USB 2.0 High-Speed Up to 3 USB 2.0 High-Speed Host ports (one with integrated PHY)
Up to 1 USB 2.0 OTG port with integrated PHY
Media Local Bus (MLB)

MOST (Media Oriented Systems Transport) interface, up to 50 Mbps

1-Wire
ISO 7816 (SIM/Smart Card)
Keypad 8x8 keypad matrix
PWM 2
ADC (10-bit) Up to 4 channels
GPIO Up to 128 GPIOs
External Memory Bus 16-bit data/28-bit address in non-multiplexed address/data mode
16-bit or 32-bit data/28-bit address in multiplexed address/data mode
Multimedia
Camera

Two parallel camera ports, up to 20-bit, up to 120 MHz peak

Display

5 interfaces available - with total rate of all interfaces up to 180 Mpixels/sec, 24 bpp

Up to 2 displays can be driven simultaneously (screen refresh)

Concurrent asynchronous access to 2 additional devices, e.g. display controllers and smart displays

Parallel: 2 24-bit display ports, up to 165 Mpixels/sec, e.g. UXGA @ 60 Hz

LVDS: 1 port up to 165 Mpixels/sec or 2 ports up to 85 Mpixels/sec, e.g. WXGA @ 60 Hz

1 TV-out/VGA port, up to 150 Mpixels/sec, e.g. 1080p60

Image Processing Unit Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction
Video Processing Unit MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG

1080p30 decode, 720p30 encode
GPU (2D/3D) 33 million triangles/sec, 200 million pixels/sec raw

OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0
Touchscreen Interface (4-wire)
SPDIF (Tx)
I2S/AC97/SSI Up to 3 channels
ESAI

Multi-channel digitial audio, up to 1.4 Mbps each channel

ASRC
Ethernet
Physical Layer 10/100Base-T
Data Rates 10/100 Mbps, auto-sensing
Duplex Mode Full or half duplex, auto-sensing
IEEE 1588 Yes, primary interface only (available on i.MX537 variant)
Power over Ethernet (802.3af)
Power Over Ethernet Development board ready for 802.3af PoE application kit (sold separately)
Accelerometer
Three-Axis Accelerometer ±2g/±4g/±8g Three-Axis Low-g
(Freescale MMA7455L)
Wireless LAN
Standard N/A 802.11a/b/g/n (2.4/5 GHz)
Antenna Connectors N/A 2 x U.FL
Dual Diversity (Receive) N/A
Frequency Bands N/A 2.412 - 2.484 GHz
4.900 - 5.850 GHz
Data Rates N/A 802.11b: 1, 2, 5.5, 11 Mbps
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 (MCS 0-7)
Modulation N/A DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM
802.11n Features N/A A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS
Transmit Power (±2 dBm) N/A 802.11b: 17 dBm typical
802.11g/n: 15 dBm typical
802.11a: 12 dBm typical
Security N/A WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i
QoS N/A WMM, WMM-PS, 802.11e
Roaming Enhancements N/A 802.11k/r
Extended Range (802.11n) N/A
Radio Certifcations N/A USA, Canada, EU, Japan
Power Requirements1
Typical/Idle 700 mA @ 3.75 V / 200 mA @ 3.75 V
Mechanical
Dimensions (L x W x H) 82 mm x 50 mm x 6.5 mm 82 mm x 50 mm x 8 mm
Module Connectors 2 x 180-pin board-to-board connectors
(Mating connector FCI P/N 61083-184409LF or similar)
Environmental
Operating Temperature -40°C to +85°C (i.MX537, 800 MHz)
-20°C to +70°C (i.MX535, 1000 MHz)
Storage Temperature -40° C up to +85° C (-40° F to +185° F)
Relative Humidity 5% to 90% (non-condensing)
Temperature / Climate Tests IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40°C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85°C), IEC 60068-2-78 (Damp heat steady state: 16h with +40°C and 93%rH)
Vibration / Shock Tests IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea
Regulatory Approvals
FCC Part 15 Class B
FCC Part 15 Sub C Section 15.247
IC RSS-210 Issue 5 Section 6.2.2(o)
EN55022:2006 Class B
ICES-003, Class B
VCCI, Class B
EN55024:1998 +A1:2001, A2:2003
EN61000-3-2:2006
EN61000-3-3:1995 +A1:2001, A2:2005
EN60950-1:2001
(UL60950-equivalent)
CSA C22.2, No. 60950
Product Warranty 3 years

1 Baseline power consumption based on standard use case without WLAN and Ethernet. See Hardware Reference Manual for more detailed information.
2 Contact your local distributor or Digi sales office for details.
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