Industry: Medical Products

Digi ConnectCore 8X SBC Pro
Intelligent and connected single board computer based on the NXP i.MX 8X; with scalable dual/quad-core performance for industrial IoT applications

Industrial i.MX 8X quad/dual-core SOM and SBC platform family
Compact Pico-ITX form factor (100 mm x 72 mm)
Power management with both hardware and software support for low-power designs
Multi-display and camera capabilities with hardware acceleration
Pre-certified dual-band 802.11a/b/g/n/ac 2x2 and Bluetooth® 5 connectivity
Seamless cellular modem and Digi XBee® 3 integration
Built-in Digi TrustFence® device security
Yocto Project® Linux® and Android™ support

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Digi ConnectCore 6+ SBC
NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless connectivity

Compact off-the-shelf SBC
Scalable capabilities and i.MX6Plus performance
Gigabit Ethernet and pre-certified dual-band 802.11ac + Bluetooth® 5
Seamless cellular modem and Digi XBee® integration
Complete set of available peripherals and interfaces with customization options
Designed for flexibility and reliability
Yocto Linux and Android software platform support
Industrial operating temperature available

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Digi ConnectCore 8X SOM based on NXP i.MX 8X
Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications

Industrial i.MX 8X quad/dual-core SOM and SBC platform family
Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability and design freedom
Power management – both hardware and software support for low-power designs
Multi-display and camera capabilities with hardware acceleration
Pre-certified dual-band 802.11a/b/g/n/ac 2x2 and Bluetooth® 5 connectivity
Seamless cellular modem and Digi XBee® 3 integration
Cloud and edge-compute services integration
Built-in device security with Digi TrustFence®
Yocto Project® Linux® and Android™ support

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Digi ConnectCore 6UL SBC Pro
Powerful, secure, pre-certified connected Single Board Computer in standard form factor with complete design flexibility.

Powerful and flexible off-the-shelf solution in Pico-ITX form factor
Production-ready with minimal hardware design effort
Rugged design with industrial operating temperature range
Pre-certified dual-band 802.11ac Wi-Fi connectivity
Bluetooth® 5, with Bluetooth Low Energy support
Out-of-box support for cellular connectivity
On-board NFC Forum Type 2 compliant tag
Dual 10/100 Mbit Ethernet networking
Integrated display and camera capabilities
Rich interface and peripheral support
Complete Yocto Project® Linux® BSP with source code
Digi TrustFence® device security framework

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Digi ConnectCore 6+
NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless

Scalable Cortex-A9 multi-core performance
Independent Cortex-M0+/Cortex-M4 Microcontroller Assist™ subsystem
Cost-effective, reliable, low-profile surface-mount module form factor
Pre-certified 802.11a/b/g/n/ac and Bluetooth® 5
Smart Power Management Architecture with PMIC
Android and Yocto Project Linux software platform support
Reliable design with IEC 60068 and HALT verification
Dedicated on-module security + authentication controller
Designed for long-term availability

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Digi ConnectCore 6UL
Intelligent and connected embedded system-on-module based on the NXP i.MX6 UL, with turnkey Linux software support in a stamp-sized form factor

Stamp-sized, secure, connected System-on-Module platform
NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
256 MB / 1 GB NAND flash, 256 MB / 1 GB DDR3
Patent-pending low-profile Digi SMTplus™ form factor
Integrated Digi Microcontroller Assist™ for 2.5 µA ultra-low power modes
Pre-certified 802.11a/b/g/n/ac + Bluetooth® 5 option
Integrated dual 10/100 Ethernet connectivity
Digi TrustFence® embedded device security framework
Royalty-free embedded Linux software platform
Turnkey development available from Digi WDS

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Digi XBee 3 Zigbee 3 RF Module
Easy-to-add connectivity in a compact, low-power, low-profile footprint

At 13 mm x 19 mm, the new Digi XBee® 3 micro form factor allows for more compact and portable applications
Digi XBee 3 is one module for all protocols including: Zigbee, 802.15.4, DigiMesh® and BLE, all configurable via Digi XCTU
Eliminate the need for an external microcontroller and create smart end nodes using MicroPython
Intrinsic IoT security with Digi TrustFence®, a layered approach securing the edge device, through the gateway, into and out of the IoT

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Digi XBee 3 802.15.4 RF Module
Low-cost, easy-to-deploy modules for critical end-point device and sensor connectivity

At 13 mm x 19 mm, the new Digi XBee® 3 micro form factor allows for more compact and portable applications
Digi XBee 3 is one module for all protocols including: ZigBee, 802.15.4, DigiMesh®, and BLE, all configurable via Digi XCTU
Eliminate the need for an external microcontroller and create smart end nodes using MicroPython
Intrinsic IoT security with Digi TrustFence®, a layered approach securing the edge device, through the gateway, into and out of the IoT

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Digi XBee 3 DigiMesh 2.4 RF Module
Wireless connectivity using the innovative and easy-to-deploy DigiMesh® protocol

At 13 mm x 19 mm, the new Digi XBee® 3 micro form factor allows for more compact and portable applications
Digi XBee 3 is one module for all protocols including: ZigBee, 802.15.4, DigiMesh®, and BLE, all configurable via Digi XCTU
Eliminate the need for an external microcontroller and create smart end nodes using MicroPython
Dual-mode radio for local configuration over Bluetooth® low energy using the Digi XBee Mobile app
Intrinsic IoT security with Digi TrustFence®, a layered approach securing the edge device, through the gateway, into and out of the IoT

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Digi ConnectCore 6
NXP i.MX6 based surface-mount module solution with scalable, single-/multi-core performance and integrated wireless

Scalable Cortex-A9 multi-core performance
Independent Cortex-M0+/Cortex-M4 Microcontroller Assist™ subsystem
Cost-effective, reliable, low-profile surface-mount module form factor
Pre-certified 802.11 a/b/g/n and Bluetooth® 4.0
Smart Power Management Architecture with PMIC
Android, Yocto Project Linux and Windows Embedded Compact software platform support
Reliable design with IEC 60068 and HALT verification
Designed for long-term availability

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Digi XBee® Wi-Fi
OEM Module with Fully Integrated Support for Digi Remote Manager

Build cloud-connected Wi-Fi prototypes in under an hour
Popular XBee Through-Hole and Surface-Mount footprints
Ideal for Industrial Applications that require fast time to market
Easily connect to a smartphone or tablet for configuration or data transfer
802.11b/g/n provides up to 72 Mbps data rate

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Digi XBee® Zigbee
Embedded ZigBee modules provide OEMs with a simple way to integrate mesh technology into their application

Programmable versions with on-board microprocessor enable custom Zigbee application development
Through-Hole and Surface Mount form factors enable flexible design options
Link budgets of 110 dB for XBee and 119 dB for XBee-PRO
Industry-leading sleep current
Firmware upgrades via UART, SPI or over the air (OTA)
Turnkey development available from Digi WDS

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Digi XBee® 802.15.4
Low-cost, easy-to-deploy RF modules provide critical end-point connectivity to devices and sensors

Simple, out-of-the-box RF communications, no configuration needed
Point-to-multipoint network topology
2.4 GHz for worldwide deployment
Common XBee footprint for a variety of RF modules
Industry leading sleep current of sub 1uA
Firmware upgrades via UART, SPI or over the air
Migratable to DigiMesh and Zigbee PRO protocols and vice-versa
Turnkey development available from Digi WDS

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Digi ConnectCore 6 SBC
Reliable and compact NXP i.MX6 SBC family with integrated Ethernet, Wi-Fi, Bluetooth 4.0, Digi XBee and cellular connectivity options

Compact off-the-shelf SBC family
Scalable capabilities and i.MX6Quad/Dual/DualLite performance
Gigabit Ethernet and pre-certified dual-band Wi-Fi + Bluetooth® 4.0
Ready for cellular connectivity and Digi XBee® RF
Complete set of available peripherals and interfaces with customizable options
Windows® Embedded Compact, Yocto Project® Linux® and Android™ software platform support
Industrial operating temperature available

Digi ConnectCore<span>®</span> i.MX53 / Wi-i.MX53

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Digi ConnectCore® i.MX53 / Wi-i.MX53
NXP/Freescale i.MX53 Cortex A8 SoM

Integrated secure wireless 802.11a/b/g/n Wi-Fi WLAN
Powerful 2D/3D graphics, 1080p video
Support for Embedded Linux, Microsoft Windows Compact 7, Android, and Yocto Project Linux
Industrial operating temperature system-on-module (SoM)

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Digi ConnectCard™ for i.MX28
NXP/Freescale i.MX28 ARM9 SoM

Cost-effective design in compact form factor
32-bit ARM processor at up to 454 MHz
Single/dual 10/100 Ethernet connectivity options
Pre-certified 802.11a/b/g/n Wi-Fi + Bluetooth 4.0
Support for Yocto Project Linux, Digi Embedded Linux, and Android

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Digi ConnectCore® 9P 9215
Highly Integrated, Network-Enabled Core Module

Compact, cost-efficient 150 MHz ARM9 module
Secure high-performance Ethernet networking
Common family footprint for wired and wireless modules
Programmable on-chip interfaces, dynamic power management

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Digi Connect ME® 9210
Intelligent Ethernet Connectivity in RJ-45 Form Factor

Wired 10/100 Ethernet network interface
Industrial operating temperature
RJ-45 form factor compatible with Digi Connect Wi-ME
Support for Digi Embedded Linux and NET+OS

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Digi ConnectCore® i.MX51 / Wi-i.MX51
NXP/Freescale i.MX51 Cortex A8 SoM

Integrated secure wireless 802.11a/b/g/n Wi-Fi LAN
Powerful 2D/3D graphics and 720p video
Support for Embedded Linux, Microsoft Windows Compact 7, Windows CE 6.0, Android, and Yocto Project Linux
Industrial operating temperature

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Digi Connect ME®
Secure Network Device Server Module

Integrated 10/100 Mbit Ethernet interface
Strong enterprise-grade network security
Common family footprint for wired and wireless modules
High-speed serial interface (UART)

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