Digi ConnectCore System-on-Modules Single Board Computers Development kits

Digi ConnectCard™ for i.MX28


NXP/Freescale i.MX28 ARM9 SoM

  • Cost-effective design in compact form factor
  • 32-bit ARM processor at up to 454 MHz
  • Single/dual 10/100 Ethernet connectivity options
  • Pre-certified 802.11a/b/g/n Wi-Fi + Bluetooth® 4.0
  • Support for Yocto Project Linux, Digi Embedded Linux, and Android

The Digi ConnectCard™ for i.MX28 is a solution-on-module based on the NXP/Freescale i.MX28 processor family. It is an ideal embedded platform solution for connected applications in medical and healthcare, energy/solar, transportation and industrial/building automation.

Offering wired and wireless connectivity, the ConnectCard for i.MX28 offers easy design integration and unique peripheral/interface flexibility in an extremely compact and cost-effective form factor suitable for a wide range of different devices, including battery powered product designs.

Digi Remote Manager empowers IT, network operations and customer support organizations to conquer the challenges of managing equipment in their device networks. Network managers can remotely configure, upgrade, monitor and troubleshoot remote devices, and create applications that improve productivity, speed and efficiency.

The ConnectCard i.MX28 module is equipped with a highly integrated 32-bit ARM core running at up to 454 MHz, on-chip power management, dual Ethernet and 802.11abgn networking options, Bluetooth 4.0 connectivity, dual FlexCAN options, GPIO, ADC, UART, USB high-speed, SPI, I2C, I2S, 1-Wire, PWM, and JTAG/ETM.

Digi JumpStart Kits for Digi Embedded Linux and Android provide a complete turnkey embedded development solution allowing immediate product development with significantly accelerated time-to-market and reduced design risk. Additional support for Yocto Embedded Linux is also available for download.

Minimize risk with Digi Software Development Support
Our software support services significantly improve time-to-market by providing experienced software design engineers who can provide programming support, code consultation, and trouble shooting for many of the current development environments including but not limited to: Python, Java, Android, C/C++, and C#.

Our mission is to use technology, existing and some that we develop, to better consume energy and with the help of Digi products, that’s what we’re able to offer.

Louis Tremblay, CEO, AddÉnergie

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Digi Product Integration

Digi WDS engineers can customize Digi hardware components and software products to accelerate your time to market.
Specifications Digi ConnectCard i.MX28 Digi ConnectCard Wi-i.MX28
Processor Models NXP® i.MX280, i.MX287
Speed Grade Up to 454 MHz
Core Type ARM926EJ-S
Cache Memory 16k I-Cache, 32k D-Cache
Internal RAM 128 KB SRAM
Internal ROM (OCOTP) 1,280 Bits
Flash Up to 2 GB NAND flash
RAM Up to 256 MB DDR2
Power Management
Power Modes Run, Standby, Deep Sleep
Wake-up Events RTC, GPIO, CAN, USB, Ethernet
Auto Slow Yes
Li-Ion Battery Charger / Monitor Yes
Clock and Watchdog
Real-Time Clock Yes
Alarm Yes
Watchdog Yes
Data Co-Processor (DCP) 128-bit AES encryption
SHA-1 / SHA256 hashing
Fusebox (OCOTP) 1280 bits
High-Assurance Boot (HAB4) Yes
Secure Boot 128-bit AES decryption
UART Up to 4 channels with bit rates up to 3.25 Mbps (AUART)
Up to 1 channel with bit rate up to 115 kbps (DUART)
CAN Bus Up to 2 channels, CAN Bus 2.0B, bit rates up to 1 Mbps, 64 message buffers (0-8 bytes), low-power modes with wake-up
SPI Up to 2, master/slave modes
I2S Up to 1
I2C Up to 2 channels, master/slave (7-/10-bit addressing), standard (100 kbps) and fast (400 kbps) mode
SD/SDIO/MMC Up to 4 ports, 1-/4-/8-bit modes, up to 48 MHz
USB 2.0 High-Speed Up to 1 USB 2.0 High-Speed Host (with PHY); Up to 1 USB 2.0 OTG port (with PHY)
1-Wire (optional) Maxim DS2482-100+
GPIO Up to 32 (depending on module variant)
PWM Up to 4
ADC HSADC: Up to 1 channel, up to 2 Mbps sample rate, 8-/10-/12-bit resolution
LRADC: Up to 6 channels, 12-bit resolution
GPIO Up to 128 GPIOs, selectable voltage (1.8/3.3V), interrupt capable
Resolution 800x480 (WVGA)
Refresh Rate Up to 60 Hz
Color Depth 8/16/24 bpp
Color Space Conversion Yes
Scaling Yes
Rotation Yes
Touch Screen
Touch Screen Controller 4-/5-wire (LRADC)
Physical Layer 10/100Base-T
Data Rates 10/100 Mbps, auto-sensing
Duplex Mode Full or half duplex, auto-sensing
IEEE 1588 Yes (i.MX287 only)
Power over Ethernet (802.3af)
Power over Ethernet Development board ready for 802.3af PoE application kit (sold separately)
Standard N/A 802.11a/b/g/n
Antenna Connectors N/A 2 x U.FL
Dual Diversity N/A Yes
Frequency Bands N/A
2.412 - 2.484 GHz; 4.900 - 5.850 GHz
Data Rates N/A
802.11b: 1, 2, 5.5, 11 Mbps
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps
(HT40, MCS 0-7)
Modulation N/A DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM
Transmit Power (±2 dBm) N/A
802.11b: 10.5 dBm typical
802.11g/n: 11 dBm typical
802.11a/n: 13 dBm typical
Security N/A WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i
Wi-Fi Logo Certification N/A Ready
CCXv4 ASD N/A Ready
Modes N/A Bluetooth 4.0 (Bluetooth 2.1 + EDR, Bluetooth 3.0 + HS 802.11 AMP, Bluetooth Low Energy)
Class N/A 1.5
Coexistence N/A Yes
Power Requirements (Use-Case Estimates)
Wi-Fi 2.4 GHz Transmit, CPU 454 MHz, 50%, UART active 475 mA at 5V
Wi-Fi 2.4 GHz Receive,
CPU Idle (Auto Slow)
325 mA at 5V
Wi-Fi Standby (Sleep),
CPU Standby (IRQ)
45 mA at 5V
Wi-Fi Standby (Host off),
CPU Deep Sleep (RTC)
1.2 mA at 5V
Module Variants1
Population Options Processor models (i.MX280, i.MX281, i.MX283, i.MX285, i.MX286, i.MX287), flash, RAM, Single 10/100 Ethernet, dual 10/100 Ethernet w/1588, 802.11a/b/g/n Wi-Fi with Bluetooth 4.0, 1-Wire, LCD connector, CAN bus
Dimensions (L x W x H) w/o JTAG/LCD connector 51 mm x 35 mm x 2.6 mm (2.01 in x 1.38 in x 0.1 in) 51 mm x 35 mm x 3 mm (2.01 in x 1.38 in x 0.12 in)
Mating Connector for Module Molex, P/N 67910-5700
Tyco, P/N 2041119-x
Retaining Clip for Module (Optional) Molex, P/N 480995701
Tyco, P/N 1717832
JTAG/LCD Connector on Module (Optional) FCI, P/N SFV31R-1STE1LF
Tyco, P/N 3-1734839-1
Operating Temperature −40 °C up to 85 °C (−40 °F to 185 °F)
Upper temperature ceilings may require active and/or passive thermal management
such as lower clock speed, thermal pads, airflow, etc.
Storage Temperature −40 °C up to 85 °C (−40 °F to 185 °F)
Relative Humidity 5% to 90% (non-condensing)
Approvals and Certifications
Emissions FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B,
VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada),
RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17
Immunity EN 55024, EN 301 489-3
Safety UL/UR, or equivalent
Radio US, Canada, EU, Japan, Australia/New Zealand
Temperature IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27
Design Test HALT
Product Warranty 3-year

1 All options available on development module. Production modules may require custom variants. Contact your local distributor or Digi sales office for details.

2 Transmit power and channel availability depending on regulatory requirements and corresponding module variants.

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