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What is Digi International's statement regarding the assembly (soldering) process recommendation for the Connect ME and Wi-ME modules

The Digi Connect ME embedded module was designed for use in no clean flux wave soldering processes. Reflow soldering is not recommended.

The product is not designed to support draining after a water-wash process, which can lead to water residue inside the enclosure due to direct entry or condensation after the wash process. As a result, Digi International can not accept any responsibility for damage to the product or other components, whether they are directly or indirectly related to the use of wave-soldering processes with water-wash cleaning.

Unpowered Modules can be placed in an oven set to 110C for 1 hour to remove internal moisture.



Last updated: Aug 08, 2017

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