Digi International Unveils Multiple Groundbreaking Solutions and Services at Embedded World 2023

New launches of wireless solutions — including the expansion of the Digi ConnectCore® and Digi XBee® embedded solution portfolios — harness the power of connected technologies to drive growth and improve efficiencies for mission critical medical, transportation, agriculture, and industrial applications


NUREMBERG, Germany, March 10, 2023 – Digi International®, (NASDAQ: DGII), a leading global provider of Internet of Things (IoT) connectivity products, solutions and services, is set to unveil a host of innovative new solutions and devices at Embedded World 2023. The company's new offerings are designed to support the needs of medical, transportation, agriculture, and industrial enterprises, empowering them to create cutting-edge solutions at a faster pace.

With a focus on delivering superior performance and unparalleled reliability, Digi International's solutions are poised to further enhance and transform the IoT landscape by enabling enterprises to harness the power of connected technologies to drive go-to-market strategies and growth.

The company's presence at Embedded World 2023 promises to be an exciting showcase of its latest offerings, and includes the following new launches:

  • Digi ConnectCore® MP13
    Digi ConnectCore MP13 is the newest member of the Digi ConnectCore® MP1 family of wireless system-on-modules (SOMs) designed for longevity, scalability and demanding product lifecycles. A compact, wireless and secure system-on-module based on the STMicroelectronics STM32MP133C MPU, Digi ConnectCore MP13 is among the industry’s smallest SOMs with pre-certified Wi-Fi 5 and Bluetooth® 5.2. This solution delivers cost-effective, flexible and reliable connectivity for original equipment manufacturers (OEMs) looking to reduce risk and product development efforts, while accelerating overall time-to-market of applications for the medical, smart energy and industrial sectors.
  • Digi ConnectCore® 93
    The wireless and highly power-efficient Digi ConnectCore 93 wireless SOM platform is designed for a wide range of medical, industrial, smart energy, transportation and Internet of Things (IoT) applications. Based on the new NXP® i.MX 93 processor, Digi ConnectCore 93 is an integrated SOM platform that integrates Wi-Fi 6 and Bluetooth 5.2 for industrial and commercial applications, designed to simplify the development of embedded products by incorporating the latest technology as well as complete lifecycle management with Digi ConnectCore Cloud Services.
  • Digi ConnectCore® Cloud Services
    Digi ConnectCore Cloud Services offer a single-source, subscription-based service that integrates software with a cloud platform to enable developers designing embedded products with ConnectCore SOMs to easily transform their products into connected devices. This service provides a simple and cost-effective solution to streamline the maintenance and management of field-deployed devices — enabling remote monitoring of device health and delivering secure, over-the-air (OTA) updates.
  • Digi XBee® 3 Family Expansion
    Digi XBee 3 Global Cellular LTE Cat 1 and Digi XBee® 3 Global Cellular LTE-M/NB-IoT smart modems deliver the power and flexibility of the renowned Digi XBee ecosystem and are pre-certified for global cellular deployments to accelerate development times and eliminate the costs associated with carrier certification processes. Supporting LTE Cat 1, LTE-M and NB-IoT networks, with 2G/3G fallback and GNSS positioning, the newest members of the Digi XBee 3 Global family are ideal for applications that require reliable cellular connectivity across the globe, and support low-power applications such as smart sensors, asset tracking and other fixed assets that send small portions of data.
  • Digi XBee® XR 868
    The Digi XBee® XR 868 module is a compact and reliable solution supporting deployment of long-range connectivity applications in the European region. The module supports both point-to-point and mesh networking protocols, with a line-of-sight range of over 14 kilometers. It is well suited for agriculture and energy applications where long-distance communication is required.
  • Digi XBee® Studio
    Digi XBee® Studio delivers a complete suite of tools for performing critical tasks that help manage and update Digi XBee devices and networks wirelessly.

“We are delighted to be unveiling a host of new products and solutions at Embedded World,” said Andreas Burghart, Senior Product Manager at Digi. “From the latest additions to our Digi ConnectCore SOMs to our innovative Digi XBee 3 smart modules, we are proud to continue our tradition of delivering and collaborating on cost-effective, embedded IoT solutions that empower our customers to drive digital transformation and achieve their business goals.”

At Embedded World, Digi will be conducting a variety of engaging live demonstrations of its technology in action. Show demonstrations taking place at Digi’s booth include:

  • EV Charging Solutions
    In collaboration with Versinetics, Digi has created a simulated EV charging station and will showcase how Digi ConnectCore System-on-Modules provide control, management and display capabilities.
  • Digi XBee Sensor Lab
    An engaging demonstration of an edge-to-cloud sensing solution, simulating smart sensors in different environments, the XBee Sensor Lab allows attendees to get hands-on with sensors and see the data changing on a dynamic display in real time — processing and transmitting data over the Cat 4 LTE-M cellular network with Digi’s new XBee 3 Global Cellular modules.
  • Digi XBots
    Demonstrating the value of remote sensing and control over LPWA (Low Power Wide Area) cellular networks, Digi XBots are small, wheeled robots that take smart sensing mobile with the XBee 3 Global Cellular modules. This demonstration allows attendees to send the robots commands via SMS texts — controlling the robots and receiving environmental and location data.
  • Connected Development Kits
    Digi will showcase the innovative ConnectCore Cloud Services connecting development kits for our new products, the Digi ConnectCore MP13, ConnectCore MP15 and ConnectCore 93. These demos show how our Cloud Services can provide remote monitoring, control and secure OTA software updates for connected devices. We also show the graphics capabilities of our SOMs with example software from Qt and Crank Ametek.

Additional demonstrations involving Digi’s leading-edge technology will be taking place at the following locations:

  • NXP – Hall 4A, Booth 4A-222
    Digi ConnectCore 93 connected development kit featuring the new NXP i.MX 93 processor.
  • STMicroelectronics – Hall 4A, Booth 4A-148
    Wall of SOMs featuring the Digi ConnectCore MP1 Development Board — ConnectCore MP157 and ConnectCore MP13 SOMs.
  • Silicon Labs – Hall 4A, Booth 4A-128 & 4A-129
    Showcasing the recently-launched Digi XBee RR module.

Digi's latest embedded IoT technologies are significantly enhancing the way in which individuals, machines, and processes interact, thanks to the support of Digi Remote Manager®, the intelligent network's command center. These technologies rely on network connectivity as the cornerstone for unlocking their full potential, positioning Digi as a leading provider of advanced networking solutions that integrate software, hardware, and services for enterprises.

For more information, stop by the Digi International Booth 131 in Hall 4A or visit: www.digi.com.

About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com.

Media Contact:
Peter Ramsay
Global Results Communications

Modified October 20, 2023
Digi ConnectCore® 93 system-on-module (SOM) platform, announced in March 2023, now supports Bluetooth 5.3.