Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Verizon SIM

Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Verizon SIM

  • Hardware
    • Cellular Chipset: Telit ME310G1-W1
    • Form factor (connector footprint): Digi XBee® 20-pin through-hole
    • Antenna options: 1 U.FL cellular, 1 U.FL Bluetooth®, 1 U.FL GNSS
    • Dimensions: 24.38 mm x 32.94 mm (0.96 in x 1.3 in)
    • Operating temperature: −40 ºC to 85 ºC (−40 ºF to 185 ºF)
    • SIM size: 4FF Nano
  • Interface and I/O
    • Data interface: UART, SPI, USB
    • Operating modes (LTE-M): Transparent and API over serial, PPP over USB
    • Operating modes (NB-IoT): Transparent, API, UDP
    • Security: Digi TrustFence® security with secure boot and protected JTAG
    • Configuration tools: Digi XBee Studio® (local), Digi Remote Manager® (OTA)
    • Embedded programmability: MicroPython with 1024 kB flash / 64 kB RAM
    • I/O: 4 ADC lines (10-bit), 13 digital I/O, USB, I2C
    • Bluetooth: Bluetooth Low Energy (BLE)
  • Cellular characteristics
    • Transmit power: Up to 23 dBm (LTE-M/NB-IoT)
    • Receive sensitivity (LTE-M): −105 dBm
    • Receive sensitivity (NB-IoT): −113 dBm
    • Supported bands: Bands B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B71, B85
    • Downlink / uplink speeds (LTE-M): Up to 588 kbps downilnk, up to 1 Mbps uplink
    • Downlink / uplink speeds (NB-IoT): Up to 120 kbps downlink, up to 160 kbps uplink
    • Duplex mode: Half-duplex
  • Power requirements (at 3.3 VDC input power)
    • Supply voltage: 3.3 – 4.3 VDC
    • Peak transmit current: 550 mA with Bluetooth disabled; 610 mA with Bluetooth enabled
    • Avg transmit current (LTE-M): 450 mA peak, 200 mA average (GM1 modules)
    • Avg transmit current (NB-IoT): 400 mA peak, 270 mA average (GM1 modules)
    • Idle: 200 mA peak, 100 mA average
    • Power save mode: 20 μA
    • Deep sleep: 2.65 μA
  • Regulatory and carrier approvals*
  • Warranty
    • 1-year
*Visit product certifications for latest updates.
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